Resin composition, resin film, and electronic device

ABSTRACT

A resin composition containing a binder resin (A), alkoxysilyl group-containing (meth)acrylate compound (B), tetrafunctional or higher functional (meth)acrylate compound (C), and photopolymerization initiator (D), wherein a total content of the alkoxysilyl group-containing (meth)acrylate compound (B) and the tetrafunctional or higher functional (meth)acrylate compound (C) is 0.5 to 10 parts by weight with respect to 100 parts by weight of the binder resin (A) is provided.

TECHNICAL FIELD

The disclosure relates to a resin composition and a resin film andelectronic device which are obtained using this resin composition, moreparticularly relates to a resin cc position which can give a resin filmwhich exhibits a high adhesion to a substrate and is excellent intransparency and chemical resistance and to a resin film and electronicdevice which are obtained using this resin composition.

BACKGROUND ART

A touch pallet or flexible organic EL display or other display devicewhich is provided with a touch panel structure or an integrated circuitdevice, solid state imaging device, color filter, black matrix, or otherelectronic device is provided with a protective film for preventingdeterioration or damage, a flattening film for flattening the devicesurface or interconnects, an electric insulating film for ensuring theelectrical insulation property, etc. constituted by various types ofresin films.

In the past, as the resin materials for forming such resin films, epoxyresins and other heat curable resin materials have been generally used.In recent years, along with the higher density of interconnects anddevices, development of new resin materials excellent in low dielectricconstant and other electrical characteristics has been sought for theseresin materials as well.

To deal with such demands, for example, Patent Document 1 discloses aradiation-sensitive resin composition containing a cyclic olefin polymerwhich has a protonic polar group, unsaturated group-containing compound,silane-modified organic-inorganic hybrid compound, andradical-generating photopolymerization initiator.

PRIOR ART DOCUMENTS Patent Documents

Patent Document 1: Japanese Patent Publication No. 2012-211988A

SUMMARY OF THE INVENTION Technical Problem

However, according to the radiation-sensitive resin compositiondisclosed in Patent Document 1, a resin film which is excellent intransparency etc. can be given, but the adhesion to a soda glasssubstrate or other transparent substrate is not necessarily sufficient.For this reason, this was not suitable for use for applications in whichresin materials excellent in adhesion to a soda glass substrate or othertransparent substrate were sought, for example, an application of aprotective film or an electrical insulating film of a display deviceprovided with a touch panel structure.

Therefore, the present invention has as its object the provision of aresin composition which can give a resin film which exhibits highadhesion to a substrate and is excellent in transparency and chemicalresistance. Further, the present invention has as its object theprovision of a resin film which is obtained using such a resincomposition and an electronic device which is provided with that resinfilm.

Solution to Problem

The present inventors engaged in intensive research for achieving theabove objects and as a result discovered that the above objects can beachieved by mixing, into a binder resin, a photopolymerization initiatorand an alkoxysilyl group-containing (meth)acrylate compound andtetrafunctional or higher functional (meth)acrylate compound in specificratios and thereby completed the present invention.

That is, according to one aspect of the present invention, there areprovided:

[1] A resin composition containing a binder resin (A), alkoxysilylgroup-containing (meth)acrylate compound (B), tetrafunctional or higherfunctional (meth)acrylate compound (C), and photopolymerizationinitiator (D), wherein a total content of the alkoxysilylgroup-containing (meth)acrylate compound (B) and the tetrafunctional orhigher functional (meth)acrylate compound (C) is 0.5 to 10 parts byweight with respect to 100 parts by weight of the binder resin (A),[2] The resin composition according to [1] wherein a content of thealkoxysilyl group-containing (meth)acrylate compound (B) is 0.25 to 4parts by weight with respect to 100 parts by weight of the binder resin(A),[3] The resin composition according to [1] or [2] wherein a content ofthe tetrafunctional or higher functional (meth)acrylate compound (C) is0.25 to 7 parts by weight with respect to 100 parts by weight of thebinder resin (A),[4] The resin composition according to any one of [1] to [3] containing,as the tetrafunctional or higher (meth)acrylate compound (C),tetrafunctional or higher functional (meth)acrylate compounds withdifferent numbers of functional groups in combination,[5] The resin composition according to any one of [1] to [4] furthercontaining an epoxy group-containing (meth)acrylate compound (E),[6] The resin composition according to [5] wherein a content of theepoxy group-containing (meth)acrylate compound (E) is 0.5 to 5 parts byweight with respect to 100 parts by weight of the binder resin (A),[7] The resin composition according to any one of [1] to [6] wherein thebinder resin (A) is a cyclic olefin polymer which has a protonic polargroup (A1), acrylic resin (A2), Cardo resin (A3), polysiloxane (A4), orpolyimide (A5),[8] The resin composition according to any one of [1] to [7] wherein thephotopolymerization initiator (D) is a radical generating typephotopolymerization initiator, and a content of the photopolymerizationinitiator (D) is 0.3 to 8 parts by weight with respect to 100 parts byweight of the binder resin (A),[9] A resin film obtained using the resin composition according to anyone of [1] to [8], and[10] An electronic device comprising the resin film according to [9].

Effects of the Invention

According to one aspect of the present invention, it is possible toprovide a resin composition which can give a resin film which exhibitshigh adhesion to a substrate and is excellent in transparency andchemical resistance, a resin film which is obtained using such a resincomposition, and an electronic device which is provided with that resinfilm.

DESCRIPTION OF EMBODIMENTS

The resin composition of one embodiment of the present inventioncontains a binder resin (A), alkoxysilyl group-containing (meth)acrylatecompound (B), tetrafunctional or higher functional (meth)acrylatecompound (C), and photopolymerization initiator (D), wherein a totalcontent of the alkoxysilyl group-containing (meth)acrylate compound (B)and the tetrafunctional or higher functional (meth)acrylate compound (C)is 0.5 to 10 parts by weight with respect to 100 parts by weight of thebinder resin (A).

(Binder Resin (A))

The binder resin (A) used in one embodiment of the present invention isnot particularly limited, but a cyclic olefin polymer which has aprotonic polar group (A1), an acrylic resin (A2), Cardo resin (A3),polysiloxane (A4), or polyimide (A5) is preferable. Among these as well,from the viewpoint of being able to improve the adhesion to a substratemore, a cyclic olefin polymer which has a protonic polar group (A1) isparticularly preferable. These binder resins (A) may respectively beused alone or as two types or more combined.

As the cyclic olefin polymer which has a protonic polar group (A1)(below, simply referred to as the “cyclic olefin polymer (A1)”), apolymer of one or more cyclic olefin monomers or a copolymer of one ormore cyclic olefin monomers and a monomer which can copolymerize withthem may be mentioned, but in one embodiment of the present invention,as the monomer for forming the cyclic olefin polymer (A1), it ispreferable to use at least a cyclic olefin monomer which has a protonicpolar group (a).

Here, the “protonic polar group” means a group which contains an atombelonging to Group XV or Group XVI of the Periodic Table to which ahydrogen atom directly bonds. Among the atoms belonging to Group XV orGroup XVI of the Periodic Table, atoms belonging to Period 1 or Period 2of Group XV or Group XVI of the Periodic Table are preferable, an oxygenatom, nitrogen atom, or sulfur atom is more preferable, and an oxygenatom is particularly preferable.

As specific examples of such a protonic polar group, a hydroxyl group,carboxy group (hydroxycarbonyl group), sulfonic acid group, phosphoricacid group, and other polar groups which have oxygen atoms; primaryamino group, secondary amino group, primary amide group, secondary amidegroup (imide group), and other polar groups which have nitrogen atoms; athiol group and other polar groups which have sulfur atoms; etc. may bementioned. Among these as well, ones which have oxygen atoms arepreferable, carboxy group is more preferable. In one embodiment of thepresent invention, the number of protonic polar groups which bond withthe cyclic olefin resin which has protonic polar groups is notparticularly limited. Further, different types of protonic polar groupsmay also be included.

As specific examples of the cyclic olefin monomer which has a protonicpolar group (a) (below, suitably called the “monomer (a)”),2-hydroxycarbonylbicyclo[2.2.1]hept-5-ene,2-methyl-2-hydroxycarbonylbicyclo[2.2.1]hept-5-ene,2-carboxymethyl-2-hydroxycarbonylbicyclo[2.2.1]hept-5-ene,2-hydroxycarbonyl-2-methoxycarbonylmethylbicyclo[2.2.1]hept-5-ene,2-hydroxycarbonyl-2-ethoxycarbonylmethylbicyclo[2.2.1]hept-5-ene,2-hydroxycarbonyl-2-propoxycarbonylmethylbicyclo[2.2.1]hept-5-ene,2-hydroxycarbonyl-2-butoxycarbonylmethylbicyclo[2.2.1]hept-5-ene,2-hydroxycarbonyl-2-pentyloxycarbonylmethylbicyclo[2.2.1]hept-5-ene,2-hydroxycarbonyl-2-hexyloxycarbonylmethylbicyclo[2.2.1]hept-5-ene,2-hydroxycarbonyl-2-cyclohexyloxycarbonylmethylbicyclo[2.2.1]hept-5-ene,2-hydroxycarbonyl-2-phenoxycarbonylmethylbicyclo[2.2.1]hept-5-ene,2-hydroxycarbonyl-2-naphthyloxycarbonylmethylbicyclo[2.2.1]hept-5-ene,2-hydroxycarbonyl-2-biphenyloxycarbonylmethylbicyclo[2.2.1]hept-5-ene,2-hydroxycarbonyl-2-benzyloxycarbonylmethylbicyclo[2.2.1]hept-5-ene,2-hydroxycarbonyl-2-hydroxyethoxycarbonylmethylbicyclo[2.2.1]hept-5-ene,2,3-dihydroxycarbonylbicyclo[2.2.1]hept-5-ene,2-hydroxycarbonyl-3-methoxycarbonylbicyclo[2.2.1]hept-5-ene,2-hydroxycarbonyl-3-ethoxycarbonylbicyclo[2.2.1]hept-5-ene,2-hydroxycarbonyl-3-propoxycarbonylbicyclo[2.2.1]hept-5-ene,2-hydroxycarbonyl-3-butoxycarbonylbicyclo[2.2.1]hept-5-ene,2-hydroxycarbonyl-3-pentyloxycarbonylbicyclo[2.2.1]hept-5-ene,2-hydroxycarbonyl-3-hexyloxycarbonylbicyclo[2.2.1]hept-5-ene,2-hydroxycarbonyl-3-cyclohexyloxycarbonylbicyclo[2.2.1]hept-5-ene,2-hydroxycarbonyl-3-phenoxycarbonylbicyclo[2.2.1]hept-5-ene,2-hydroxycarbonyl-3-naphthyloxycarbonylbicyclo[2.2.1]hept-5-ene,2-hydroxycarbonyl-3-biphenyloxycarbonylbicyclo[2.2.1]hept-5-ene,2-hydroxycarbonyl-3-benzyloxycarbonylbicyclo[2.2.1]hept-5-ene,2-hydroxycarbonyl-3-hydroxyethoxycarbonylbicyclo[2.2.1]hept-5-ene,2-hydroxycarbonyl-3-hydroxycarbonylmethylbicyclo[2.2.1]hept-5-ene,3-methyl-2-hydroxycarbonylbicyclo[2.2.1]hept-5-ene,3-hydroxymethyl-2-hydroxycarbonylbicyclo[2.2.1]hept-5-ene,2-hydroxycarbonyltricyclo[5.2.1.0^(2,6)]deca-3,8-diene,4-hydroxycarbonyltetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-9-ene,4-methyl-4-hydroxycarbonyltetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-9-ene,4,5-dihydroxycarbonyltetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-9-ene,4-carboxymethyl-4-hydroxycarbonyltetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-9-ene,N-(hydroxycarbonylmethyl)bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(hydroxycarbonylethyl)bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(hydroxycarbonylpentyl)bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(dihydroxycarbonylethyl)bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(dihydroxycarbonylpropyl)bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(hydroxycarbonylphenethyl)bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(2-(4-hydroxyphenyl)-1-(hydroxycarbonyl)ethyl)bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(hydroxycarbonylphenyl)bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,and other carboxy group-containing cyclic olefins;2-(4-hydroxyphenyl)bicyclo[2.2.1]hept-5-ene,2-methyl-2-(4-hydroxyphenyl)bicyclo[2.2.1]hept-5-ene,4-(4-hydroxyphenyl)tetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-9-ene,4-methyl-4-(4-hydroxyphenyl)tetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-9-ene,2-hydroxybicyclo[2.2.1]hept-5-ene,2-hydroxymethylbicyclo[2.2.1]hept-5-ene,2-hydroxyethylbicyclo[2.2.1]hept-5-ene,2-methyl-2-hydroxymethylbicyclo[2.2.1]hept-5-ene,2,3-dihydroxymethylbicyclo[2.2.1]hept-5-ene,2-(hydroxyethoxycarbonyl)bicyclo[2.2.1]hept-5-ene,2-methyl-2-(hydroxyethoxycarbonyl)bicyclo[2.2.1]hept-5-ene,2-(1-hydroxy-1-trifluormethyl-2,2,2-trifluoroethyl)bicyclo[2.2.1]hept-5-ene,2-(2-hydroxy-2-trifluoromethyl-3, 3,3-trifluoropropyl)bicyclo[2.2.1]hept-5-ene,3-hydroxytricyclo[5.2.1.0^(2,6)]deca-4,8-diene,3-hydroxymethyltricyclo[5.2.1.0^(2,6)]deca-4,8-diene,4-hydroxytetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-9-ene,4-hydroxymethyltetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-9-ene,4,5-dihydroxymethyltetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-9-ene,4-(hydroxyethoxycarbonyl)tetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-9-ene,4-methyl-4-(hydroxyethoxycarbonyl)tetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-9-ene,N-(hydroxyethyl)bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(hydroxyphenyl)bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide, and otherhydroxyl group-containing cyclic olefins etc. may be mentioned. Amongthese as well, from the viewpoint of the adhesion of the obtained resinfilm becoming higher, carboxy group-containing cyclic olefins arepreferable, while4-hydroxycarbonyltetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-9-ene isparticularly preferable. These monomers (a) may respectively be usedalone or may be used as two types or more combined.

In the cyclic olefin polymer (A1), the ratio of content of the units ofthe monomer (a) is preferably 10 to 90 mol % with respect to all monomerunits. By the ratio of content of the units of the monomer (a) being inthis range, heat resistance and solubility in a polar solvent can befurther improved with a good balance.

Further, the cyclic olefin polymer (A1) used in one embodiment of thepresent invention may be a copolymer which is obtained bycopolymerization of a cyclic olefin monomer which has a protonic polargroup (a) and a monomer (b) which can copolymerize with this. As such acopolymerizable monomer (b), a cyclic olefin monomer which has a polargroup other than a protonic polar group (b1), a cyclic olefin monomerwhich does not have a polar group (b2), and a monomer other than acyclic olefin (b3) (below, suitably called the “monomer (b1)”, “monomer(b2)”, and “monomer (b3)”) may be mentioned.

As the cyclic olefin monomer which has a polar group other than aprotonic polar group (b1), for example, a cyclic olefin which has anN-substituted imide group, ester group, cyano group, acid anhydridegroup, or halogen atom may be mentioned.

As a cyclic olefin which has an N-substituted imide group, for example,a monomer represented by the following formula (1) or a monomerrepresented by the following formula (2) may be mentioned.

(In the above formula (1), R¹ indicates a hydrogen atom or C₁ to C₁₆alkyl group or aryl group. “n” indicates an integer of 1 to 2.)

(In the above formula (2), R² indicates a C₁ to C₃ bivalent alkylenegroup, while R³ indicates a C₁ to C₁₀ monovalent alkyl group or a C₁ toC₁₀ monovalent halogenated alkyl group.)

In the above formula (1), R¹ is a C₁ to C₁₆ alkyl group or aryl group.As specific examples of the alkyl group, a methyl group, ethyl group,n-propyl group, n-butyl group, n-pentyl group, n-hexyl group, n-heptylgroup, n-octyl group, n-nonyl group, n-decyl group, n-undecyl group,n-dodecyl group, n-tridecyl group, n-tetradecyl group, n-pentadecylgroup, n-hexadecyl group, and other straight chain alkyl groups;cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexylgroup, cycloheptyl group, cyclooctyl group, cyclononyl group, cyclodecylgroup, cycloundecyl group, cyclododecyl group, norbornyl group, bornylgroup, isobornyl group, decahydronaphthyl group, tricyclodecanyl group,adamantyl group, and other cyclic alkyl groups; 2-propyl group, 2-butylgroup, 2-methyl-1-propyl group, 2-methyl-2-propyl group, 1-methylbutylgroup, 2-methylbutyl group, 1-methylpentyl group, 1-ethylbutyl group,2-methylhexyl group, 2-ethylhexyl group, 4-methylheptyl group,1-methylnonyl group, 1-methyltridecyl group, 1-methyltetradecyl group,and other branched alkyl groups; etc. may be mentioned. Further, asspecific examples of the aryl group, a benzyl group etc. may bementioned. Among these as well, due to the more excellent heatresistance and solubility in a polar solvent, a C₆ to C₁₄ alkyl groupand aryl group are preferable, while a C₆ to C₁₀ alkyl group and arylgroup are more preferable. If the number of carbon atoms is 4 or less,the solubility in a polar solvent is inferior, while if the number ofcarbon atoms is 17 or more, the heat resistance is inferior. Further,when patterning the resin film, there is the problem that the resin filmmelts by heat and the patterns to end up disappearing.

As specific examples of the monomer represented by the above formula(1), bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-phenyl-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-methylbicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-ethylbicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-propylbicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-butylbicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-cyclohexylbicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-adamantylbicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(1-methylbutyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(2-methylbutyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(1-methylpenyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(2-methylpentyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(1-ethylbutyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(2-ethylbutyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(1-methylhexyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(2-methylhexyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(3-methylhexyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(1-butylpentyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(2-butylpentyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(1-methylheptyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(2-methylheptyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(3-methylheptyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(4-methylheptyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(1-ethylhexyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(2-ethylhexyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(3-ethylhexyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(1-propylpentyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(2-propylpentyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(1-methyloctyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(2-methyloctyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(3-methyloctyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(4-methyloctyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(1-ethylheptyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(2-ethylheptyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(3-ethylheptyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(4-ethylheptyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(1-propylhexyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(2-propylhexyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(3-propylhexyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(1-methylnonyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(2-methylnonyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(3-methylnonyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(4-methylnonyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(5-methylnonyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(1-ethyloctyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(2-ethyloctyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(3-ethyloctyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(4-ethyloctyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(1-methyldecyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(1-methyldodecyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(1-methylundecyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(1-methyldodecyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(1-methyltridecyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(1-methyltetradecyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-(1-methylpentadecyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide,N-phenyl-tetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-9-ene-4,5-dicarboxyimide, N-(2,4-dimethoxyphenyl)-tetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-9-ene-4,5-dicarbox yimide, etc. may be mentioned. Note that, these mayrespectively be used alone or may be used as two types or more combined.

On the other hand, in the above formula (2), R² is a C₁ to C₃ bivalentalkylene group. As the C₁ to C₃ bivalent alkylene group, a methylenegroup, ethylene group, propylene group, and isopropylene group may bementioned. Among these as well, due to the excellent polymerizationactivity, a methylene group and ethylene group are preferable.

Further, in the above formula (2), R³ is a C₁ to C₁₀ monovalent alkylgroup or C₁ to C₁₀ monovalent halogenated alkyl group. As the C₁ to C₁₀monovalent alkyl group, for example, a methyl group, ethyl group, propylgroup, isopropyl group, butyl group, sec-butyl group, tert-butyl group,hexyl group, cyclohexyl group, etc. may be mentioned. As the C₁ to C₁₀monovalent halogenated alkyl group, for example, a fluoromethyl group,chloraethyl group, bromomethyl group, difluoromethyl group,dichloromethyl group, difluoroethyl group, trifluoromethyl group,trichloroethyl group, 2,2, 2-trifluoroethyl group, pentafluoroethylgroup, heptafluoropropyl group, perfluorobutyl group, perfluoropentylgroup, etc. may be mentioned. Among these as well, since the solubilityin a polar solvent is excellent, as R³, a methyl group or ethyl group ispreferable.

Note that, the monomer represented by the above formulas (1) and (2)can, for example, be obtained by an imidization reaction between acorresponding amine and 5-norbornene-2,3-dicarboxylic acid anhydride.Further, the obtained monomer can be efficiently isolated by separatingand refining the reaction solution of the imidization reaction by aknown method.

As the cyclic olefin which has an ester group, for example,2-acetoxybicyclo[2.2.1]hept-5-ene,2-acetoxymethylbicyclo[2.2.1]hept-5-ene,2-methoxycarbonylbicyclo[2.2.1]hept-5-ene,2-ethoxycarbonylbicyclo[2.2.1]hept-5-ene,2-propoxycarbonylbicyclo[2.2.1]hept-5-ene,2-butoxycarbonylbicyclo[2.2.1]hept-5-ene,2-cyclohexyloxycarbonylbicyclo[2.2.1]hept-5-ene,2-methyl-2-methoxycarbonylbicyclo[2.2.1]hept-5-ene,2-methyl-2-ethoxycarbonylbicyclo[2.2.1]hept-5-ene,2-methyl-2-propoxycarbonylbicyclo[2.2.1]hept-5-ene,2-methyl-2-butoxycarbonylbicyclo[2.2.1]hept-5-ene,2-methyl-2-cyclohexyloxycarbonylbicyclo[2.2.1]hept-5-ene, 2-(2,2,2-trifluoroethoxycarbonyl)bicyclo[2.2.1]hept-5-ene, 2-methyl-2-(2,2,2-trifluoroethoxycarbonyl)bicyclo[2.2.1]hept-5-ene,2-methoxycarbonyltricyclo[5.2.1.0^(2,6)]dec-8-ene,2-ethoxycarbonyltricyclo[5.2.1.0^(2,6)]dec-8-ene,2-propoxycarbonyltricyclo[5.2.1.0^(2,6)]dec-8-ene,4-acetoxytetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-9-ene,4-methoxycarbonyltetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-9-ene,4-ethoxycarbonyltetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-9-ene,4-propoxycarbonyltetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-9-ene,4-butoxycarbonyltetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-9-ene,4-methyl-4-methoxycarbonyltetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-9-ene,4-methyl-4-ethoxycarbonyltetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-9-ene,4-methyl-4-propoxycarbonyltetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-9-ene,4-methyl-4-butoxycarbonyltetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-9-ene,4-(2,2,2-trifluoroethoxycarbonyl)tetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-9-ene,4-methyl-4-(2,2,2-trifluoroethoxycarbonyl)tetracyclo[6.2.1.1^(3,6)0^(2,7)]dodec-9-ene,etc. may be mentioned.

As the cyclic olefin which has a cyano group, for example,4-cyanotetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-9-ene,4-methyl-4-cyanotetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-9-ene,4,5-dicyanotetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-9-ene,2-cyanobicyclo[2.2.1]hept-5-ene,2-methyl-2-cyanobicyclo[2.2.1]hept-5-ene,2,3-dicyanobicyclo[2.2.1]hept-5-ene, etc. may be mentioned.

As the cyclic olefin which has an acid anhydride group, for example,tetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-9-ene-4,5-dicarboxylic anhydride,bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic anhydride,2-carboxymethyl-2-hydroxycarbonylbicyclo[2.2.1]hept-5-ene anhydride,etc. may be mentioned.

As the cyclic olefin which has a halogen atom, for example,2-chlorobicyclo[2.2.1]hept-5-ene,2-chloromethylbicyclo[2.2.1]hept-5-ene,2-(chlorophenyl)bicyclo[2.2.1]hept-5-ene,4-chlorotetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-9-ene,4-methyl-4-chlorotetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-9-ene, etc. maybe mentioned.

These monomers (b1) may respectively be used alone or may be used as twotypes or more combined.

As the cyclic olefin monomer which does not have a polar group (b2),bicyclo[2.2.1]hept-2-ene (also called “norbornene”),5-ethylbicyclo[2.2.1]hept-2-ene, 5-butyl-bicyclo[2.2.1]hept-2-ene,5-ethylidene-bicyclo[2.2.1]hept-2-ene,5-methylidene-bicyclo[2.2.1]hept-2-ene,5-vinyl-bicyclo[2.2.1]hept-2-ene, tricyclo[5.2.1.0^(2,6)]deca-3,8-diene(common name: dicyclopentadiene),tetracyclo[10.2.1.0^(2,11).0^(4,9)]pentadec-4,6,8,13-tetraene,tetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-4-ene (also called“tetracyclododecene”),9-methyl-tetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-4-ene,9-ethyl-tetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-4-ene,9-methylidene-tetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-4-ene,9-ethylidene-tetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-4-ene,9-vinyl-tetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-4-ene,9-propenyl-tetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-4-ene,pentacyclo[9.2.1.1^(3,9).0^(2,10).0^(4,8)]pentadeca-5,12-diene,cyclobutene, cyclopentene, cyclopentadiene, cyclohexene, cycloheptene,cyclooctene, cyclooctadiene, indene,3a,5,6,7a-tetrahydro-4,7-methano-1H-indene,9-phenyl-tetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-4-ene,tetracyclo[9.2.1.0^(2,10).0^(3,8)]tetradec-3,5,7,12-tetraene,pentacyclo[9.2.1.1^(3,9).0^(2,10).0^(4,8)]pentadec-12-ene, etc. may bementioned. These monomers (b2) may respectively be used alone or my beused as two types or more combined.

As specific examples of the monomer other than a cyclic olefin (b3),ethylene; propylene, 1-butene, 1-pentene, 1-hexene, 3-methyl-1-butene,3-methyl-1-pentene, 3-ethyl-1-pentene, 4-methyl-1-pentene,4-methyl-1-hexene, 4,4-dimethyl-1-hexene, 4,4-dimethyl-1-pentene,4-ethyl-1-hexene, 3-ethyl-1-hexene, 1-octene, 1-decene, 1-dodecene,1-tetradecene, 1-hexadecene, 1-octadecene, 1-eicosene, and other C₂ toC₂₀ α-olefins; 1,4-hexadiene, 1,5-hexadiene, 4-methyl-1,4-hexadiene,5-methyl-1,4-hexadiene, 1,7-octadiene, and other nonconjugated dienesand their derivatives; etc. may be mentioned. Among these as well,α-olefin is preferable. These monomers (b3) may respectively be usedalone or may be used as two types or more combined.

Among these monomers (b1) to (b3) as well, from the viewpoint of theeffect of one embodiment of the present invention becoming moreremarkable, a cyclic olefin monomer which has a polar group other than aprotonic polar group (b1) is preferable, while a cyclic olefin which hasan N-substituted imide group is particularly preferable.

In the cyclic olefin polymer (A1), the ratio of content of units of thecopolymerizable monomer (b) is preferably 10 to 90 mol % with respect tothe total monomer units. If the ratio of content of the units of thecopolymerizable monomer (b) is too small, the cyclic olefin polymer (A1)is liable to become insufficient in solubility in a polar solvent, whileif too great, heat resistance is liable to become insufficient.

Note that, in one embodiment of the present invention, it is alsopossible to introduce a protonic group in a cyclic olefin-based polymerwhich does not have a protonic polar group utilizing a known modifyingagent so as to obtain the cyclic olefin polymer (A1). The polymer whichdoes not have a protonic polar group can be obtained by polymerizing atleast one of the above-mentioned monomers (b1) and (b2) and, inaccordance with need, a monomer (b3) in any combination.

Note that, the cyclic olefin polymer (A1) used in one embodiment of thepresent invention may be a ring-opened polymer obtained by ring-openingpolymerization of the above-mentioned monomers or may be an additionpolymer obtained by addition polymerization of the above-mentionedmonomers, but from the viewpoint of the effect of one embodiment of thepresent invention becoming more remarkable, a ring-opened polymer ispreferable.

A ring-opened polymer can be produced by ring-opening methathesispolymerization of a cyclic olefin monomer which has a protonic polargroup (a) and a copolymerizable monomer (b) used according to need inthe presence of a methathesis reaction catalyst. As the method ofproduction, for example, the method described in InternationalPublication No. 2010/110323A, [0039] to [0079], etc. can be used. On theother hand, an addition polymer can be obtained by causingpolymerization of a cyclic olefin monomer which has a protonic polargroup (a) and a copolymerizable monomer (b) used according to need usinga known additional polymerization catalyst, for example, a catalystcomprised of a compound of titanium, zirconium, or vanadium and anorganic aluminum compound.

Further, when the cyclic olefin polymer (A1) used in one embodiment ofthe present invention is a ring-opened polymer, it is preferable tofurther perform a hydrogenation reaction and obtain a hydrogenatedproduct in which the carbon-carbon double bonds which are contained inthe main chain are hydrogenated. When the cyclic olefin polymer (A1) isa hydrogenated product, the ratio of the hydrogenated carbon-carbondouble bonds (hydrogenation rate) is usually 50% or more. From theviewpoint of the heat resistance, 70% or more is preferable, 90% or moreis more preferable, and 95% or more is furthermore preferable.

Further, the acrylic resin (A2) used in one embodiment of the presentinvention is not particularly limited, but a homopolymer or copolymerhaving at least one of a carboxylic acid which has an acryl group,carboxylic anhydride which has an acryl group, epoxy group-containingacrylate compound and oxetane group-containing acrylate compound as anessential ingredient is preferable.

As specific examples of the carboxylic acid which has an acryl group,(meth)acrylic acid (meaning acrylic acid and/or methacrylic acid, below,same for methyl(meth)acrylate etc.), crotonic acid, maleic acid, fumaricacid, citraconic acid, mesaconic acid, glutaconic acid, phthalic acidmono-(2-((meth)acryloyloxy)ethyl), N-(carboxyphenyl)maleimide,N-(carboxyphenyl)(meth)acrylamide, etc. may be mentioned. As specificexamples of the carboxylic anhydride which has an acryl group, maleicanhydride, citraconic anhydride, etc. may be mentioned.

As specific examples of the epoxy group-containing acrylate compound,glycidyl acrylate, glycidyl methacrylate, glycidyl α-ethyl acrylate,glycidyl α-n-propyl acrylate, glycidyl α-n-butyl acrylate,3,4-epoxybutyl acrylate, 3,4-epoxybutyl methacrylate, 6,7-epoxyheptylacrylate, 6,7-epoxyheptyl methacrylate, 6,7-epoxyheptyl α-ethylacrylate,3,4-epoxycyclohexylmethyl acrylate, 3,4-epoxycyclohexylmethylmethacrylate, etc. may be mentioned.

As specific examples of the oxetane group-containing acrylate compound,(3-methyloxetan-3-yl)methyl (meth)acrylate, (3-ethyloxetan-3-yl)methyl(meth)acrylate, (3-methyloxetan-3-yl)ethyl (meth)acrylate,(3-ethyloxetan-3-yl)ethyl (meth)acrylate,(3-chloromethyloxetan-3-yl)methyl (meth)acrylate, (oxetan-2-yl)methyl(meth)acrylate, (2-methyloxetan-2-yl)methyl (meth)acrylate,(2-ethyloxetan-2-yl)methyl (meth)acrylate,(1-methyl-1-oxetanyl-2-phenyl)-3-(meth)acrylate,(1-methyl-1-oxetanyl)-2-trifluoromethyl-3-(meth)acrylate, and(1-methyl-1-oxetanyl)-4-trifluormethyl-2-(meth)acrylate, etc. may bementioned. Among these as well, (meth)acrylic acid, maleic anhydride,glycidyl (meth)acrylate, 6,7-epoxyheptyl methacrylate, etc. arepreferable.

The acrylic resin (A2) may also be a copolymer of at least one compoundwhich is selected from unsaturated carboxylic acids, unsaturatedcarboxylic anhydrides, and epoxy group-containing unsaturated compounds,and other acrylate-based monomers or copolymerizable monomers other thanacrylates.

As other acrylate-based monomers, methyl (meth)acrylate, ethyl(meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, butyl(meth)acrylate, isobutyl (meth)acrylate, t-butyl (meth)acrylate, amyl(meth)acrylate, isoamyl (meth)acrylate, hexyl (meth)acrylate, heptyl(meth)acrylate, octyl (meth)acrylate, isooctyl (meth)acrylate,ethylhexyl (meth)acrylate, nonyl (meth)acrylate, decyl (meth)acrylate,isodecyl (meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate,lauryl (meth)acrylate, stearyl (meth)acrylate, isostearyl(meth)acrylate, and other alkyl (meth)acrylates; hydroxyethyl(meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl(meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl(meth)acrylate, 4-hydroxybutyl (meth)acrylate, and other hydroxyalkyl(meth)acrylates; phenoxyethyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl(meth)acrylate, and other phenoxyalkyl (meth)acrylates; 2-methoxyethyl(meth)acrylate, 2-ethoxyethyl (meth)acrylate, 2-propoxyethyl(meth)acrylate, 2-butoxyethyl (meth)acrylate, 2-methoxybutyl(meth)acrylate, and other alkoxyalkyl (meth)acrylates; polyethyleneglycol mono(meth)acrylate, ethoxydiethylene glycol (meth)acrylate,methoxypolyethylene glycol (meth)acrylate, phenoxypolyethylene glycol(meth)acrylate, nonyl phenoxypolyethylene glycol (meth)acrylate,polypropylene glycol mono(meth)acrylate, methoxypolypropylene glycol(meth)acrylate, ethoxypolypropylene glycol (meth)acrylate,nonylphenoxypolypropylene glycol (meth)acrylate, and other polyalkyleneglycol (meth)acrylates; cyclohexyl (meth)acrylate, 2-methylcyclohexyl(meth)acrylate, 4-butylcyclohexyl (meth)acrylate, 1-adamantyl(meth)acrylate, 2-methyl-2-adamantyl (meth)acrylate, 2-ethyl-2-adamantyl(meth)acrylate, tricyclo[5.2.1.0^(2,6)]decan-8-yl (meth)acrylate,tricyclo[5.2.1.0^(2,6)]-3-decen-8-yl (meth)acrylate,tricyclo[5.2.1.0^(2,6)]-3-decen-9-yl (meth)acrylate, bornyl(meth)acrylate, isobornyl (meth)acrylate, and other cycloalkyl(meth)acrylates; phenyl (meth)acrylate, naphthyl (meth)acrylate,biphenyl (meth)acrylate, benzyl (meth)acrylate, tetrahydrofurfuryl(meth)acrylate, 5-tetrahydrofurfuryl oxycarbonylpentyl (meth)acrylate,vinyl (meth)acrylate, allyl (meth)acrylate, 2-(2-vinyloxyethoxy)ethyl(meth)acrylate, 2-[tricyclo[5.2.1.0^(2,6)]decan-8-yloxy]ethyl(meth)acrylate, 2-[tricyclo[5.2.1.0^(2,6)]-3-decen-8-yloxy]ethyl(meth)acrylate, 2-[tricyclo[5.2.1.0^(2,6)]-3-decen-9-yloxy]ethyl(meth)acrylate, γ-butyrolactone (meth)acrylate, maleimide,N-methylmaleimide, N-ethylmaleimide, N-butylmaleimide,N-cyclohexylmaleimide, N-benzylmaleimide, N-phenylmaleimide,N-(2,6-diethylphenyl)maleimide, N-(4-acetylphenyl)maleimide,N-(4-hydroxyphenyl)maleimide, N-(4-acetoxyphenyl)maleimide,N-(4-dimethylamino-3,5-dinitrophenyl)maleimide,N-(1-anilinonaphthyl-4)maleimide,N-[4-(2-benzooxazolyl)phenyl]maleimide, N-(9-acridinyl)maleimide, etc.may be mentioned. Among these as well, methyl (meth)acrylate, butyl(meth)acrylate, cyclohexyl (meth)acrylate, 2-methylcyclohexyl(meth)acrylate, benzyl (meth)acrylate, tricyclo[5.2.1.0^(2,6)]decan-8-yl(meth)acrylate, N-phenylmaleimide, N-cyclohexylmaleimide, etc. arepreferable.

The copolymerizable monomer other than acrylate is not particularlylimited so long as a compound which can copolymerize with the abovecarboxylic acid which has an acryl group, carboxylic anhydride which hasan acryl group, epoxy group-containing acrylate compound, but, forexample, vinylbenzylmethyl ether, vinylglycidyl ether, styrene,α-methylstyrene, vinyltoluene, indene, vinylnaphthalene, vinylbiphenyl,chlorostyrene, bromostyrene, chloromethylstyrene, p-tert-butoxystyrene,p-hydroxystyrene, p-hydroxy-α-methylstyrene, p-acetoxystyrene,p-carboxystyrene, 4-hydroxyphenylvinylketone, acrylonitrile,methacrylonitrile, (meth)acrylamide, 1,2-epoxy-4-vinylcyclohexane,isobutene, norbornene, butadiene, isoprene, and other radicalpolymerizable compounds may be mentioned. These compounds mayrespectively be used alone or may be used as two types or more combined.The polymerization method of the above monomer may be an ordinarymethod. For example, the suspension polymerization method, the emulsionpolymerization method, the solution polymerization method, etc. may beemployed.

The Cardo resin (A3) used in one embodiment of the present invention isa resin which has a Cardo structure, that is, a skeletal structure withtwo cyclic structures bonded to a quaternary carbon atom which forms acyclic structure. A general form of a Cardo structure is a structure inwhich benzene rings bond to a fluorene ring.

As specific examples of a skeletal structure where two cyclic structuresare bonded to a quaternary carbon atom forming a cyclic structure, afluorene skeleton, bisphenol fluorene skeleton, bisaminophenyl fluoreneskeleton, fluorine skeleton having an epoxy group, fluorene skeletonhaving an acryl group, etc. may be mentioned.

The Cardo resin (A3) used in one embodiment of the present invention isformed by polymerization by reacting functional groups which bond toskeletons having Cardo structure each other. The Cardo resin (A3) has astructure where the main chain and bulky side chains are connected by asingle element (Cardo structure) and has a cyclic structure in thedirection substantially vertical to the main chain.

As one example of the Cardo structure, an example of a Cardo structurehaving an epoxyglycidyl ether structure is shown in the followingformula (3).

(In the above formula (3), “n” is an integer of 0 to 10.)

The monomer which has a Cardo structure is, for example, abis(glycidyloxyphenyl)fluorene-type epoxy resin; a condensate of abisphenolfluorene-type epoxy resin and acrylic acid;9,9-bis(4-hydroxyphenyl)fluorene,9,9-bis(4-hydroxy-3-methylphenyl)fluorene, or other Cardostructure-containing bisphenols; 9,9-bis(cyanomethyl)fluorene or other9,9-bis(cyanoalkyl)fluorenes; 9,9-bis(3-aminopropyl)fluorene or other9,9-bis(aminoalkyl)fluorenes; etc. may be mentioned.

The Cardo resin (A3) is a polymer which is obtained by polymerization ofa monomer which has a Cardo structure, but may also be a copolymer withanother copolymerizable monomer.

The polymerization method of the above monomers may be an ordinarymethod. For example, the ring-opening polymerization method or additionpolymerization method etc. may be employed.

The polysiloxane (A4) used in one embodiment of the present invention isnot particularly limited, but preferably a polymer which is obtained bymixing and reacting one or more types of organosilane represented by thefollowing formula (4) may be mentioned.

(R⁴)_(m)—Si—(OR⁵)_(4-m)  (4)

In the above formula (4), R⁴ is a hydrogen atom, C₁ to C₁₀ alkyl group,C₂ to C₁₀ alkenyl group, or C₆ to C₁₅ aryl group. The plurality of R⁴may be the same or different. Note that, these alkyl groups, alkenylgroups, and aryl groups may all have substituents. Further, they may benonsubstituted groups which do not have substituents and may be selectedin accordance with the properties of the composition. As specificexamples of the alkyl group, a methyl group, ethyl group, n-propylgroup, isopropyl group, n-butyl group, t-butyl group, n-hexyl group,n-decyl group, trifluoromethyl group, 2,2,2-trifluoroethyl group,3,3,3-trifluoropropyl group, 3-glycidoxypropyl group, 2-(3,4-epoxycyclohexyl)ethyl group, 3-aminopropyl group, 3-mercaptopropyl group, and3-isocyanatepropyl group may be mentioned. As specific examples of thealkenyl group, a vinyl group, 3-acryloxypropyl group, and3-methacryloxypropyl group may be mentioned. As specific example of thearyl group, a phenyl group, tolyl group, p-hydroxyphenyl group,1-(p-hydroxyphenyl)ethyl group, 2-(p-hydroxyphenyl)ethyl group,4-hydroxy-5-(p-hydroxyphenylcarbonyloxy)pentyl group, and naphthyl groupmay be mentioned.

Further, in the above formula (4), R⁵ is a hydrogen atom, C₁ to C₆ alkylgroup, C₁ to C₆ acyl group, or C₆ to C₁₅ aryl group, where the pluralityof R⁵ may be the same or different. Note that, these alkyl groups andacyl groups may all have substituents. Further, they may benonsubstituted groups which do not have substituents and may be selectedin accordance with the properties of the composition. As specificexamples of the alkyl group, a methyl group, ethyl group, n-propylgroup, isopropyl group, and n-butyl group may be mentioned. As aspecific example of the acyl group, an acetyl group may be mentioned. Asa specific example of an aryl group, a phenyl group may be mentioned.

Furthermore, in the above formula (4), “m” is an integer of 0 to 3. Whenm=0, the compound becomes tetrafunctional silane, when m=1, it becomestrifunctional silane, when m=2, it becomes bifunctional silane, and whenm=3, it becomes monofunctional silane.

As specific examples of an organosilane represented by the above formula(4), tetramethoxysilane, tetraethoxysilane, tetraacetoxysilane,tetraphenoxysilane, or other tetrafunctional silanes;methyltrimethoxysilane, methyltriethoxysilane,methyltriisopropoxysilane, methyltri-n-butoxysilane,ethyltrimethoxysilane, ethyltriethoxysilane, ethyltriisopropoxysilane,ethyltri-n-butoxysilane, n-propyltrimethoxysilane,n-propyltriethoxysilane, n-butyltrimethoxysilane,n-butyltriethoxysilane, n-hexyltrimethoxysilane, n-hexyltriethoxysilane,decyltrimethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane,3-methacryloxypropyltrimethoxysilane,3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane,phenyltrimethoxysilane, phenyltriethoxysilane,p-hydroxyphenyltrimethoxysilane,1-(p-hydroxyphenyl)ethyltrimethoxysilane,2-(p-hydroxyphenyl)ethyltrimethoxysilane,4-hydroxy-5-(p-hydroxyphenylcarbonyloxy)pentyltrimethoxysilane,trifluorcnethyltrimethoxysilane, trifluoranethyltriethoxysilane,3,3,3-trifluoropropyltrimethoxysilane, 3-aminopropyltrimethoxysilane,3-aminopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane,2-(3,4-epoxy cyclohexyl)ethyltrimethoxysilane,3-mercaptopropyltrimethoxysilane, or other trifunctional silanes;dimethyldimethoxysilane, dimethyldiethoxysilane,dimethyldiacetoxysilane, di-n-butyldimethoxysilane,diphenyldimethoxysilane, or other bifunctional silanes;trimethylmethoxysilane, tri-n-butylethoxysilane, or other monofunctionalsilanes; may be mentioned.

Among these organosilanes, from the viewpoint of the crack resistance orhardness of the obtained resin film, trifunctional silanes arepreferably used. These organosilanes may be used alone or may be used astwo types or more combined.

The polysiloxane (A4) used in one embodiment of the present invention isobtained by the hydrolysis or partial condensation of theabove-mentioned organosilanes. For the hydrolysis and partialcondensation, general methods can be used. For example, a solvent,water, and according to need a catalyst are added to the mixture andheated and stirred. During stirring, in accordance with need,distillation may be used to distill off the hydrolysis byproducts(methanol or other alcohol) or condensation byproduct (water).

The polyimide (A5) used in one embodiment of the present invention canbe obtained by heat treating a polyimide precursor obtained by reactinga tetracarboxylic anhydride and diamine. As the precursor for obtainingthe polyimide, a polyamic acid, polyamic acid ester, polyisoimide,polyamic acid sulfonamide, etc. may be mentioned.

The polyimide (A5) used in one embodiment of the present invention issynthesized by a known method. That is, it is synthesized by a knownmethod such as selectively combining tetracarboxylic dianhydride and adiamine and reacting these in N-methyl-2-pyrrolidone,N,N-dimethylacetoamide, N,N-dimethylformamide, dimethylsulfoxide,hexamethylphosphoric triamide, γ-butyrolactone, cyclopentanone, or otherpolar solvent.

When excessively using a diamine for polymerization, it is possible tomake a carboxylic anhydride react with the end amino group of theproduced polyimide (A5) so as to protect the end amino group. Further,when excessively using tetracarboxylic anhydride for polymerization, itis possible to make an amine compound react with the end acid anhydridegroup of the produced polyimide (A5) so as to protect the end acidanhydride group.

As examples of such carboxylic anhydrides, phthalic anhydride,trimellitic anhydride, maleic anhydride, naphthalic anhydride,hydrogenated phthalic anhydride, methyl-5-norbornene-2,3-dicarboxylicanhydride, itaconic anhydride, tetrahydrophthalic acid anhydride, etc.may be mentioned, while as examples of amine compounds, aniline,2-hydroxyaniline, 3-hydroxyaniline, 4-hydroxyaniline, 2-ethynylaniline,3-ethynylaniline, 4-ethynylaniline, etc. may be mentioned.

The binder resin (A) used in the present invention has a weight averagemolecular weight (Mw) of usually 1,000 to 1,000,000, preferably 1,500 to100,000, more preferably 2,000 to 10,000 in range.

Further, the binder resin (A) has a molecular weight distribution of aweight average molecular weight/number average molecular weight (Mw/Mn)ratio of usually 4 or less, preferably 3 or less, more preferably 2.5 orless.

The weight average molecular weight (Mw) and molecular weightdistribution (Mw/Mn) of the binder resin (A) are values which are foundby gel permeation chromatography (GPC) using tetrahydrofuran and othersolvents as eluents and as values converted to polystyrene.

(Alkoxysilyl Group-Containing (Meth)Acrylate Compound (B))

The alkoxysilyl group-containing (meth)acrylate compound (B) used in oneembodiment of the present invention is a (meth)acrylic acid (acrylicacid and/or methacrylic acid (same below)) ester is a (meth)acrylic acid(acrylic acid and/or methacrylic acid (same below)) ester which has analkoxysilyl group. In one embodiment of the present invention, byjointly using such an alkoxysilyl group-containing (meth)acrylatecompound (B), later explained tetrafunctional or higher functional(meth)acrylate compound (C), and photopolymerization initiator (D) andmaking the total ratio of content of the alkoxysilyl group-containing(meth)acrylate compound (B) and the tetrafunctional or higher functional(meth)acrylate compound (C) a specific range, the resin film which isobtained using the resin composition of one embodiment of the presentinvention can be made excellent in adhesion to a substrate.

As specific examples of the alkoxysilyl group-containing (meth)acrylatecompound (B), 2-acryloxyethyl trimethoxysilane, 2-acryloxyethyltriethoxysilane, 3-acryloxypropyl trimethoxysilane,3-acryloxypropylmethyl dimethoxysilane, 3-acryloxypropyltriethoxysilane, 4-acryloxybutyl trimethoxysilane, 4-acryloxybutyltriethoxysilane, 2-methacryloxyethyl trimethoxysilane,2-methacryloxyethyl triethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyl dimethoxysilane,3-methacryloxypropyl triethoxysilane, 3-methacryloxymethyldiethoxysilane, 4-methacryloxybutyl trimethoxysilane,4-methacryloxybutyl triethoxysilane, etc. may be mentioned. Among theseas well, an alkoxysilyl group-containing acrylate compound ispreferable, 2-acryloxyethyl trimethoxysilane, 3-acryloxypropyltrimethoxysilane, 3-acryloxypropylmethyl dimethoxysilane, and4-acryloxybutyl trimethoxysilane are more preferable, and3-acryloxypropyl trimethoxysilane is particularly preferable. These maybe used as single type alone or as two types or more combined.

In the resin composition of one embodiment of the present invention, thecontent of the alkoxysilyl group-containing (meth)acrylate compound (B)is, as a total with the later explained tetrafunctional or higherfunctional (meth)acrylate compound (C), preferably 0.5 to 10 parts byweight with respect to 100 parts by weight of the binder resin (A), morepreferably 0.8 to 8 parts by weight, furthermore preferably 1.1 to 6parts by weight, most preferably 3 to 5 parts by weight. By making thetotal content of these the above range, the adhesion to a substrate canbe further improved.

Note that, in the resin cc position of one embodiment of the presentinvention, the content of the alkoxysilyl group-containing(meth)acrylate compound (B) may be made an amount whereby the content ofthe total with the tetrafunctional or higher functional (meth)acrylatecompound (C) becomes the above range, but the content of the alkoxysilylgroup-containing (meth)acrylate compound (B) alone is preferably 0.25 to4 parts by weight with respect to 100 parts by weight of the binderresin (A), more preferably 0.5 to 4 parts by weight, furthermorepreferably 0.5 to 2.5 parts by weight, particularly preferably 0.8 to 2parts by weight. By making the content of the alkoxysilylgroup-containing (meth)acrylate compound (B) alone with respect to 100parts by weight of the binder resin (A) the above range, the adhesion toa substrate can be further improved.

(Tetrafunctional or Higher Functional (Meth)acrylate Compound (C))

The tetrafunctional or higher functional (meth)acrylate compound (C)used in one embodiment of the present invention is a (meth)acrylic acidester which has four or more (meth)acryloyl groups.

As specific examples of the tetrafunctional or higher functional(meth)acrylate compound (C), dipentaerythritol hexaacrylate(hexafunctional) (for example, product name “DPHA”, made by DaicelCytec, or product name “Light Acrylate DPE-6A”, made by Kyoei KagakuKogyo, or product name “A-DPH”, made by Shin-Nakamura Chemical),pentaerythritol ethoxy tetracrylate (tetrafunctional) (for example,product name “EBECRYIA0”, made by Daicel Cytec), ditrimethylolpropanetetracrylate (tetrafunctional) (for example, product name “AD-TMP”, madeby Shin-Nakamura Chemical), ethoxylated pentaerythritol tetracrylate(tetrafunctional) (for example, product name “ATM-35E”, made byShin-Nakamura Chemical), pentaerythritol tetracrylate (tetrafunctional)(for example, product name “A-TMMT”, made by Shin-Nakamura Chemical),dipentaerythritol polyacrylate (for example, product name “A-9550”, madeby Shin-Nakamura Chemical), pentaerythritol tri/tetracrylate(trifunctional and tetrafunctional mixture) (for example, product name“Aronix M-303 Tri 40-60%”, or product name “Aronix M-305 Tri 55-63%”, orproduct name “Aronix M-306 Tri 65-70%”, all made by Toagosei),dipentaerythritol penta/hexaacrylate (pentafunctional and hexafunctionalmixture) (for example, product name “Aronix M-402 Penta 30-40%”, orproduct name “Aronix M-406 Penta 25-35%”, all made by Toagosei),ditrimethylolpropane tetracrylate (tetrafunctional) (for example,product name “Aronix M-408”, made by Toagosei), polybasic acid-modifiedacrylic oligomer (for example, product name “Aronix M-510”, made byToagosei), etc. may be mentioned. These may be used as single type aloneor as two types or more combined. As the tetrafunctional or higherfunctional (meth)acrylate compound (C), from the viewpoint of improvingmore the adhesion to a substrate, use of tetrafunctional or higherfunctional (meth)acrylate compounds with different numbers of functionalgroups in combination is preferable (including the case of use of amixture of (meth)acrylate compounds with different numbers of functionalgroups), while use of a pentafunctional (meth)acrylate compound and ahexafunctional (meth)acrylate compound in combination is preferable.

In the resin composition of one embodiment of the present invention, thecontent of the tetrafunctional or higher functional (meth)acrylatecompound (C) may be made an amount whereby the total content with theabove-mentioned alkoxysilyl group-containing (meth)acrylate compound (B)becomes the above range, but the content of the tetrafunctional orhigher functional (meth)acrylate compound (C) alone is preferably 0.25to 7 parts by weight with respect to 100 parts by weight of the binderresin (A), more preferably 0.5 to 7 parts by weight, furthermorepreferably 0.5 to 5 parts by weight, particularly preferably 1 to 4parts by weight, most preferably 2 to 4 parts by weight. By making thecontent of the tetrafunctional or higher functional (meth)acrylatecompound (C) with respect to 100 parts by weight of the binder resin (A)the above range, the adhesion to a substrate can be further improved.

(Photopolymerization Initiator (D))

The photopolymerization initiator (D) used in one embodiment of thepresent invention is not particularly limited so long as a compoundwhich causes a chemical reaction by light, but a radical generating typephotopolymerization initiator which generates radicals due to light andthereby causes a chemical reaction is preferable. In particular, amongradical generating type photopolymerization initiators, a compound whichhas a sensitivity with respect to 400 nm or less wavelength light andgenerates radicals and which causes a chemical reaction when beingirradiated by 400 nm or less wavelength light, specifically ultravioletlight or electron beams and other radiation, is preferable.

As specific examples of such a radical generating typephotopolymerization initiator, benzophenone, methyl o-benzoyl benzoate,4,4-bis(dimethylamine) benzophenone, 4,4-bis(diethylamine)benzophenone,α-amino-acetophenone, 4,4-dichlorobenzophenone,4-benzoyl-4-methyldiphenylketone, dibenzylketone, fluorene,2,2-diethoxyaoetophenone, 2,2-dimethoxy-2-phenylacetophenone,2-hydroxy-2-methylpropiophenone, p-tert-butyldichloroaoetophenone,thioxantone, 2-methylthioxantone, 2-chlorothioxantone,2-isopropylthioxantone, diethylthioxantone, benzyldimethylketal,benzylmethoxyethylacetal, benzoinmethyl ether, benzoinbutyl ether,anthraquinone, 2-tert-butylanthraquinone, 2-amylbutylanthraquinone,β-chloroanthraquinone, anthrone, benzanthrone, dibenzsuberon, methyleneanthrone, 4-acidabenzylacetophenone,2,6-bis(p-azidebenzylidene)cyclohexane,2,6-bis(p-azidebenzylidene)-4-methylcyclohexanone,2-phenyl-1,2-butadione-2-(o-methoxycarbonyl)oxime,1-phenyl-propanedion-2-(o-ethoxycarbonyl)oxime,1,3-diphenyl-propanetrione-2-(o-ethoxycarbonyl)oxime,1-phenyl-3-ethoxy-propanetrione-2-(o-benzoyl)oxime, Michler's ketone,2-methyl-1[4-(methylthio)phenyl]-2-morpholinopropan-1-one,2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone,naphthalenesulfonyl chloride, quinolinesulfonyl chloride,n-phenylthioacrylidone, 4,4-azobisisobutyronitrile, diphenyl disulfide,benzothiazole disulfide, triphenylphosphine, camphorquinone,N,N-octamethylenebisacridine,2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone(product name “Irgacure 379EG”, made by BASF),1-hydroxy-cyclohexyl-phenyl-ketone (product name “IRGACURE 184”, made byBASF),2-hydroxy-1-(4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]phenyl)-2-methylpropan-1-one (product name “IRGACURE 127”, made by BASF),2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one (product name“IRGACURE 907”, made by BASF), 1,7-bis(9-acridyl)-heptane (made byADEKA, N1717), 1,2-octanedion, 1-[4-(phenylthio)-,2-(o-benzoyloxime)](made by BASF, OXE-01), ethanone,1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-, 1-(o-acetyloxime)(made by BASF, OXE-02), carbon tetrachloride, tribromophenylsulfone,benzoin peroxide, eosin, methylene blue, and other photoreducing dyesand ascorbic acid or triethanolamine and other reducing agents incombination etc. may be mentioned. These may be used as single typealone or as two types or more combined.

In the resin composition of one embodiment of the present invention, thecontent of the photopolymerization initiator (D) is preferably 0.3 to 8parts by weight with respect to 100 parts by weight of the binder resin(A), more preferably 0.5 to 6 parts by weight, furthermore preferably0.7 to 4 parts by weight. By making the content of thephotopolymerization initiator (D) this range, the adhesion to asubstrate can be made more excellent.

(Epoxy Group-Containing (Meth)acrylate Compound (E))

The resin composition of one embodiment of the present inventionpreferably contains, in addition to the above-mentioned binder resin(A), alkoxysilyl group-containing (meth)acrylate compound (B),tetrafunctional or higher functional (meth)acrylate compound (C), andphotopolymerization initiator (D), an epoxy group-containing(meth)acrylate compound (E). By further containing an epoxygroup-containing (meth)acrylate compound (E), the obtained resin filmcan be further raised in adhesion to a substrate.

As specific examples of the epoxy group-containing (meth)acrylatecompound (E), glycidyl acrylate, glycidyl methacrylate, glycidyl α-ethylacrylate, glycidyl α-n-propyl acrylate, glycidyl α-n-butyl acrylate,3,4-epoxybutyl acrylate, 3,4-epoxybutyl methacrylate, 6,7-epoxyheptylacrylate, 6,7-epoxyheptyl methacrylate, 6,7-epoxyheptyl α-ethylacrylate,3,4-epoxycyclohexylmethyl acrylate, 3,4-epoxycyclohexylmethylmethacrylate (for example, product name “Cyclomer M100”, made byDaicel), 4-glycidyloxy-3,5-dimethylbenzyl acrylate,4-glycidyloxy-3,5-dimethylbenzyl methacrylate, etc. may be mentioned.These may be used as single type alone or as two types or more combined.Among these as well, epoxy group-containing (meth)acrylate compoundswhich have alicyclic structures are preferable, while 3,4-epoxycyclohexylmethyl methacrylate is particularly preferable. By using, asthe epoxy group-containing (meth)acrylate compound, an epoxygroup-containing (meth)acrylate compound which has an alicyclicstructure, the adhesion to a substrate can be further improved.

In the resin composition of one embodiment of the present invention, thecontent of the epoxy group-containing (meth)acrylate compound (E) ispreferably 0.5 to 5 parts by weight with respect to 100 parts by weightof the binder resin (A), more preferably 0.8 to 3 parts by weight. Bymaking the content of the epoxy group-containing (meth)acrylate compound(E) this range, the effect of addition, that is, the effect ofimprovement of the adhesion to a substrate, can made more remarkable.

(Cross-Linking Agent (F))

Further, the resin composition of one embodiment of the presentinvention preferably further contains, in addition to theabove-mentioned ingredients, a cross-linking agent (F). As thecross-linking agent (F), one which forms a cross-linked structurebetween cross-linking agent molecules due to heating or one which reactswith the binder resin (A) to form a cross-linked structure between resinmolecules may be mentioned, specifically, a compound which has two ormore reactive groups may be mentioned. As such a reactive group, forexample, an amino group, carboxy group, hydroxyl group, epoxy group, orisocyanate group may be mentioned. More preferably, it is an aminogroup, epoxy group, or isocyanate group. An amino group or epoxy groupis particularly preferable.

The molecular weight of the cross-linking agent (F) is not particularlylimited, but is usually 100 to 100,000, preferably 300 to 50,000, morepreferably 500 to 10,000. The cross-linking agent (F) may be used assingle type alone or as two types or more combined.

As specific examples of the cross-linking agent (E),hexamethylenediamine and other aliphatic polyamines;4,4′-diaminodiphenyl ether, diaminodiphenyl sulfone, and other aromaticpolyamines; 2,6-bis(4′-azidobenzal)cyclohexanone, 4,4′-diazidodiphenylsulfone, and other azides; nylon, polyhexamethylenediamineterephthalamide, polyhexamethyleneisophthalamide, and other polyamides;N,N,N′,N′,N″,N″-(hexaalkoxyalkyl) melamine, and other melamines whichmay have a methylol group, imino group, etc. (product name “Cymel 303,Cymel 325, Cymel 370, Cymel 232, Cymel 235, Cymel 272, Cymel 212, Mycoat506” (above, made by Cytec Industries) and other Cymel series and Mycoatseries products); N,N′,N″,N″′-(tetraalkoxyalkyl)glycoluryl, and otherglycolurils which may have a methylol group, imino group etc. (productname “Cymel 1170” (above, made by Cytec Industries) and other Cymelseries products); ethylene glycol di(meth)acrylate and other acrylatecompounds; hexamethylene diisocyanate-based polyisocyanate, isophoronediisocyanate-based polyisocyanate, tolylene diisocyanate-basedpolyisocyanate, hydrated diphenylmethane diisocyanate, and otherisocyanate-based compounds; 1,4-di-(hydroxymethyl)cyclohexane,1,4-di-(hydroxymethyl) norbornane; 1,3,4-trihydroxycyclohexane;bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, phenolnovolac-type epoxy resin, cresol novolac-type epoxy resin,polyphenol-type epoxy resin, cyclic aliphatic epoxy resin, aliphaticglycidyl ether, epoxy acrylate polymer, and other epoxy compounds; maybe mentioned.

Further, as specific examples of the epoxy compound, a trifunctionalepoxy compound which has a dicyclopentadiene structure (product name“XD-1000”, made by Nippon Kayaku), a 1,2-epoxy-4-(2-oxiranyl)cyclohexaneadduct of 2,2-bis(hydroxymethyl) 1-butanol (pentadecafunctionalalicyclic epoxy resin having a cyclohexane structure and end epoxygroups, product name “EHPE3150”, made by Daicel Chemical Industry),epoxylated 3-cyclohexene-1,2-dicarboxylic acid bis(3-cyclohexenylmethyl)modified e-caprolactone (aliphatic cyclic trifunctional epoxy resin,product name “Epolide GT301”, made by Daicel Chemical Industry),epoxylated butanetetracarboxylic acid tetrakis(3-cyclohexenylmethyl)modified e-caprolactone (aliphatic cyclic tetrafunctional epoxy resin,product name “Epolide GT401”, made by Daicel Chemical Industry), andother epoxy compounds having alicyclic structures;

aromatic amine-type polyfunctional epoxy compound (product name “H-434”,made by Tohto Chemical Industry), cresol novolac-type polyfunctionalepoxy compound (product name “EOCN-1020”, made by Nippon Kayaku), phenolnovolac-type polyfunctional epoxy compound (Epicoat 152, 154, made byJapan Epoxy Resin), polyfunctional epoxy compound having a naphthalenestructure (product name EXA-4700, made by DIC), chainalkylpolyfunctional epoxy compound (product name “SR-TMP”, made bySakamoto Yakuhin Kogyo Co., Ltd.), polyfunctional epoxy polybutadiene(product name “Epolide PB3600”, made by Daicel Chemical Industry),glycidyl polyether compound of glycerin (product name “SR-GLG”, made bySakamoto Yakuhin Kogyo Co., Ltd.), diglycerin polyglycidyl ethercompound (product name “SR-DGE”, made by Sakamoto Yakuhin Kogyo Co.,Ltd.), polyglycerin polyglycidyl ether compound (product name “SR-4GL”,made by Sakamoto Yakuhin Kogyo Co., Ltd.), and other epoxy compounds nothaving an alicyclic structure; may be mentioned.

In the resin composition of one embodiment of the present invention, thecontent of the cross-linking agent (F) is not particularly limited andmay be freely set considering the extent of heat resistance which issought to the resin film which is obtained by using the resincomposition of one embodiment of the present invention, but ispreferably 3 to 70 parts by weight with respect to 100 parts by weightof the binder resin (A), more preferably 4 to 45 parts by weight,furthermore preferably 5 to 25 parts by weight. Whether thecross-linking agent (F) is too great or too small, the heat resistancetends to fall.

(Other Compounding Agents)

The resin composition of one embodiment of the present invention mayfurther contain a solvent. The solvent is not particularly limited, butone known as a solvent of a resin composition, for example, acetone,methylethylketone, cyclopentanone, 2-hexanone, 3-hexanone, 2-heptanone,3-heptanone, 4-heptanone, 2-octanone, 3-octanone, 4-octanone, or otherstraight chain ketones; n-propyl alcohol, isopropyl alcohol, n-butylalcohol, cyclohexanol, or other alcohols; ethyleneglycol dimethyl ether,ethyleneglycol diethyl ether, dioxane, or other ethers; ethyleneglycolmonomethyl ether, ethyleneglycol monoethyl ether, or other alcoholethers; propyl formate, butyl formate, propyl acetate, butyl acetate,methyl propionate, ethyl propionate, methyl butyrate, ethyl butyrate,methyl lactate, ethyl lactate, or other esters; cellosolve acetate,methylcellosolve acetate, ethylcellosolve acetate, propylcellosolveacetate, butylcellosolve acetate, or other cellosolve esters;propyleneglycol, propyleneglycol monaethyl ether, propylene glycolmonomethyl ether acetate, propylene glycol monoethyl ether acetate,propylene glycol monobutyl ether, or other propylene glycols; diethyleneglycol monomethyl ether, diethylene glycol monoethyl ether, diethyleneglycol dimethyl ether, diethylene glycol diethyl ether, diethyleneglycol methylethyl ether, or other diethylene glycols; γ-butyrolactone,γ-valerolactone, γ-caprolactone, γ-caprylolactone, or other saturatedγ-lactones; trichloroethylene or other halogenated hydrocarbons;toluene, xylene, or other aromatic hydrocarbons; dimethylacetoamide,dimethylformamide, N-methylacetoamide, or other polar solvents; etc. maybe mentioned. These solvents may be used alone or as two types or morecombined. The content of the solvent is preferably 10 to 10000 parts byweight with respect to 100 parts by weight of the binder resin (A), morepreferably 50 to 5000 parts by weight, furthermore preferably 100 to1000 parts by weight in range. Note that, when the resin composition ismade to include a solvent, the solvent is normally removed after formingthe resin film.

Further, the resin composition of one embodiment of the presentinvention may be one which contains, in addition to the aboveingredients, a radiation-sensitive compound. A radiation-sensitivecompound is a compound which can cause a chemical reaction byirradiation by ultraviolet rays or an electron beam or other radiation.In one embodiment of the present invention, the radiation-sensitivecompound is preferably one which can control the alkali solubility of aresin film which is comprised of the resin composition, particularly aphotoacid generator is preferable.

As such a radiation-sensitive compound, for example, an acetophenonecompound, triaryl sulfonium salt, quinone diazide compound, and otherazide compounds etc. may be mentioned, but it is preferably an azidecompound, particularly preferably a quinone diazide compound.

As the quinone diazide compound, for example, an ester compound of aquinone diazide sulfonic acid halide and a compound which has a phenolichydroxyl group can be used. As specific examples of the quinone diazidesulfonic acid halide, 1,2-naphthoquinone diazide-5-sulfonic acidchloride, 1,2-naphthoquinone diazide-4-sulfonic acid chloride,1,2-benzoquinone diazide-5-sulfonic acid chloride, etc. may bementioned. As typical examples of a compound which has a phenolichydroxyl group,1,1,3-tris(2,5-dimethyl-4-hydroxyphenyl)-3-phenylpropane,4,4′-[1-[4-[1-[4-hydroxyphenyl]-1-methylethyl]phenyl]ethylidene]bisphenol,etc. may be mentioned. As other compounds which have a phenolic hydroxylgroup, 2,3,4-trihydroxybenzophenone, 2,3,4,4′-tetrahydroxybenzophenone,2-bis(4-hydroxyphenyl)propane, tris(4-hydroxyphenyl)methane,1,1,1-tris(4-hydroxy-3-methylphenyl)ethane,1,1,2,2-tetrakis(4-hydroxyphenyl)ethane, oligomers of novolac resins,oligomers obtained by copolymerization of a compound which has one ormore phenolic hydroxyl groups and dicyclopentadiene, etc. may bementioned.

Among these as well, a condensate of 1,2-naphthoquinonediazide-5-sulfonic acid chloride and a compound which has a phenolichydroxyl group is preferable, while a condensate of1,1,3-tris(2,5-dimethyl-4-hydroxyphenyl)-3-phenylpropane (1 mole) and1,2-naphthoquinone diazide-5-sulfonic acid chloride (1.9 mole) is morepreferable.

Further, as the photoacid generator, in addition to the quinone diazidecompound, an osmium salt, halogenated organic compound,α,α′-bis(sulfonyl)diazomethane-based compound,α-carbonyl-α′-sulfonyldiazomethane-based compound, sulfone compound,organic acid ester compound, organic acid amide compound, organic acidimide compound, or other known one can be used. Theseradiation-sensitive compounds may be used as single type alone or as twotypes or more combined.

Further, the resin composition of one embodiment of the presentinvention may contain, to an extent where the effects of one embodimentof the present invention are not inhibited, as desired a surfactant,acidic compound, coupling agent or its derivative, sensitizer, latentacid generator, antioxidant, photostabilizer, defoamer, pigment, dye,filler, and other compounding agents etc.

The surfactant is used to prevent striation, improve the developmentproperty, and for other purposes. As specific examples of thesurfactant, polyoxyethylene lauryl ether, polyoxyethylene stearyl ether,polyoxyethylene oleyl ether, and other polyoxyethylene alkyl ethers;polyoxyethylene octylphenyl ether, polyoxyethylene nonyl phenyl ether,and other polyoxyethylene aryl ethers; polyoxyethylene dilaurate,polyoxyethylene distearate, and other polyoxyethylene dialkyl esters,and other nonion-based surfactants; fluorine-based surfactants;silicone-based surfactants; methacrylic acid copolymer-basedsurfactants; acrylic acid copolymer-based surfactants; etc. may bementioned.

The coupling agent or its derivative has the effect of further raisingthe adhesion of a resin film comprised of the resin composition and thelayers, including the semiconductor layer, which forms the semiconductordevice substrate. As the coupling agent or its derivative, a compoundwhich has one atom selected from a silicon atom, titanium atom, aluminumatom, and zirconium atom and has a hydrocarbyloxy group or hydroxylgroup which bonds with that atom can be used.

As the coupling agent or its derivative, for example,tetraalkoxysilanes, trialkoxysilanes, dialkoxysilanes, alkoxysilanes,silicon atom-containing compounds, titanium atom-containing compounds,zirconium atom-containing compounds, etc. may be mentioned, but amongthese, trialkoxysilanes are preferable. As specific examples of thetrialkoxysilanes, N-phenyl-3-aminopropyltrimethoxysilane,3-glycidoxypropyltrimethoxysilane, etc. may be mentioned.

As specific examples of the sensitizer, 2H-pyrido-(3,2-b)-1,4-oxazin-3(4H)-ones, 10H-pyrido (3,2-b)-1,4-benzothiadines, urazoles, hydantoins,barbituric acids, glycine anhydrides, 1-hydroxybenzotriazoles, alloxans,maleimides, etc. may be mentioned.

As antioxidants, a phenol-based antioxidant, phosphorus-basedantioxidant, sulfur-based antioxidant, lactone-based antioxidant, etc.used for a usual polymer can be used. For example, as phenols,2,6-di-t-butyl-4-methylphenol, p-methoxyphenol, styrenated phenol,n-octadecyl-3-(3′,5′-di-t-butyl-4′-hydroxyphenyl) propionate,2,2′-methylene-bis(4-methyl-6-t-butylphenol),2-t-butyl-6-(3′-t-butyl-5′-methyl-2′-hydroxybenzyl)-4-methylphenylacrylate,4,4′-butylidene-bis-(3-methyl-6-t-butylphenol),4,4′-thio-bis(3-methyl-6-t-butylphenol), pentaerythritoltetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], alkylatedbisphenol, etc. may be mentioned. As the phosphorus-based antioxidants,triphenyl phosphite and tris(nonylphenyl) phosphite may be mentioned,while as the sulfur-based ones, dilauryl thiodipropionate etc. may bementioned.

As light stabilizers, benzophenone-based, salicyclic acid ester-based,benzotriazole-based, cyanoacrylate-based, metal complex-based, and otherultraviolet ray absorbers, hindered amine-based light stabilizers (HALS)and other stabilizers which trap radicals generated due to light may beused. Among these as well, a HALS is a compound which has a piperidinestructure and is preferable since it causes little coloring with respectto a radiation-sensitive resin composition and is good in stability. Asspecific compounds, bis(2,2,6,6-tetramethyl-4-piperidyl) sebacate,1,2,2,6,6-pentamethyl-4-piperidyl/tridecyl-1,2,3,4-butanetetracarboxylate,bis(1-octyloxy-2,2,6,6-tetramethyl-4-piperidyl)sebacate, etc. may bementioned.

The method of preparation of the resin composition of one embodiment ofthe present invention is not particularly limited, but the ingredientsforming the resin composition may be mixed by a known method.

The method of mixing is not particularly limited, but it is preferableto dissolve or disperse the components which form the resin compositionin solvents and mix the solutions or dispersions. Due to this, the resincomposition is obtained in the form of a solution or dispersion.

The method of dissolving or dispersing the components which form theresin composition in solvents may be an ordinary method. Specifically,this may be performed by stirring using a stirring bar and magneticstirrer, high speed homogenizer, disperser, planetary stirrer,twin-screw stirrer, ball mill, triple roll, etc. Further, theingredients may also be dissolved or dispersed in a solvent, then forexample filtered using a filter with a pore size of 0.5 μm or so etc.

The solid content concentration of the resin composition of oneembodiment of the present invention is usually 1 to 70 wt %, preferably5 to 60 wt %, more preferably 10 to 50 wt %. If the solid contentconcentration is in this range, stability of dissolution, coatability,uniformity of thickness and flatness of the resin film which is formed,etc. are obtained in a high balance.

Further, in the resin composition of one embodiment of the presentinvention, the ratios of content of Na, Mg, Al, K, Ca, Cr, Mn, Fe, andNi is preferably a weight ratio with respect to the totalradiation-sensitive resin composition of preferably less than 500 ppb,more preferably less than 200 ppb, particularly preferably less than 100ppb.

(Resin Film)

The resin film of one embodiment of the present invention can beobtained using the above-mentioned resin composition of one embodimentof the present invention. The resin film of one embodiment of thepresent invention is preferably obtained by the above-mentioned resincomposition of one embodiment of the present invention being formed onthe substrate.

As the substrate, for example, a printed circuit board, silicon wafersubstrate, soda glass or other glass substrate, polyethylene naphthalateor other plastic substrate, etc. may be used. Among these as well, asoda glass substrate used for a display device provided with a touchpanel structure or a polyethylene naphthalate substrate is preferablyused.

The method of forming the resin film is not particularly limited, butfor example the coating method, film lamination method, or other methodcan be used.

The coating method is, for example, the method of coating a resincomposition, then drying by heating to remove the solvent. As the methodof coating the resin composition, for example, the spray method, spincoat method, roll coat method, die coat method, doctor blade method,spin coat method, bar coat method, screen print method, and othervarious methods can be employed. The heating and drying conditionsdiffer according to the type and ratio of the ingredients, but areusually 30 to 150° C., preferably 60 to 120° C. usually for 0.5 to 90minutes, preferably 1 to 60 minutes, more preferably 1 to 30 minutes.

The film lamination method is a method comprising coating a resincomposition on a resin film, metal film or other substrate for formingB-stage film, then heating and drying it to remove the solvent to obtainthe B-stage film, then laminating this B-stage film. The heating anddrying conditions may be suitably selected in accordance with the typesand ratios of content of the ingredients, but the heating temperature isusually 30 to 150° C. and the heating time is usually 0.5 to 90 minutes.The film lamination may be performed by using a press laminator, press,vacuum laminator, vacuum press, roll laminator, and other press bondingmachines.

The thickness of the resin film is not particularly limited, but may besuitably set in accordance with the application, but when the resin filmis a protective film or insulating film of, for example, a touch panelstructure of a display device provided with a touch panel structure, thethickness of the resin film is preferably 0.1 to 100 μm, more preferably0.5 to 50 μm, furthermore preferably 0.5 to 30 μm.

Further, when the resin composition of one embodiment of the presentinvention includes a cross-linking agent (F), the resin film which isformed by the above-mentioned coating method or film lamination methodcan be cross-linked. This cross-linking may be performed by selecting asuitable method in accordance with the type of the cross-linking agent(F), but usually is performed by heating. The heating method, forexample, may be one using a hot plate, oven, etc. The heatingtemperature is usually 180 to 250° C. The heating time is suitablyselected in accordance with the area or thickness of the resin film, theequipment which is used, etc. For example, when using a hot plate, it isnormally 5 to 60 minutes, while when using an oven, it is normally 30 to90 minutes. The heating may be performed in accordance with need in aninert gas atmosphere. The inert gas may be one which does not containoxygen and which does not oxidize a resin film. For example, nitrogen,argon, helium, neon, xenon, krypton, etc. may be mentioned. Among theseas well, nitrogen and argon are preferable. In particular, nitrogen ispreferable. In particular, inert gas with an oxygen content of 0.1 vol %or less, preferably 0.01 vol % or less, in particular nitrogen, issuitable. These inert gases may be respectively used alone or as twotypes or more combined.

Further, when the above-mentioned resin composition contains theradiation-sensitive compound, the resin film which is formed using theresin composition may be patterned if necessary. As the method ofpatterning a resin film, for example, the method of forming a resin filmbefore patterning, irradiating active radiation at the resin film beforepatterning to form latent patterns, then bringing the resin film whichhas the latent patterns into contact with the developing solution tobring out the patterns etc. may be mentioned.

The active radiation is not particularly limited so long as able toactivate radiation-sensitive compound contained in the resin compositionand change the alkali solubility of the resin composition containing theradiation-sensitive compound. Specifically, ultraviolet light, g-rays ori-rays and other single wavelength ultraviolet light, KrF excimer laserlight, ArF excimer laser light, and other light beams; electron beamsand other particle beams; etc. may be used. As the method of selectivelyradiating active radiation in a pattern manner to form latent patterns,an ordinary method may be used. For example, the method of using areduced projection exposure apparatus etc. to irradiate ultravioletlight, g-rays, i-rays, KrF excimer laser light, ArF excimer laser light,and other light beams through a desired mask pattern or the method ofusing an electron beam or other particle beam for lithography etc. maybe used. When using light beams as active radiation, single wavelengthlight or mixed wavelength light may be used. The irradiation conditionsmay be suitably selected in accordance with the active radiation used,but, for example, when using wavelength 200 to 450 nm light beams, theamount of irradiation is normally 10 to 1,000 mJ/cm², preferably 50 to500 mJ/a in range and is determined in accordance with the irradiationtime and illuminance. After irradiating the active radiation in thisway, in accordance with need, the resin film is heat treated at 60 to130° C. or so in temperature for 1 to 2 minutes or so.

Next, the latent patterns which are formed in the resin film beforepatterning are developed to bring them out. As the developing solution,normally aqueous solutions of alkali compounds may be used. As alkalicompounds, for example, alkali metal salts, amines, and ammonium saltsmay be used. The alkaline compounds may be inorganic compounds ororganic cc pounds. As specific examples of these compounds, sodiumhydroxide, potassium hydroxide, sodium carbonate, sodium silicate,metasodium silicate, and other alkali metal salts; ammonia water;ethylamine, n-propylamine, and other primary amines; diethylamine,di-n-propylamine, and other secondary amines; triethylamine,methyldiethylamine, and other tertiary amines; tetramethylammoniumhydroxide, tetraethylammonium hydroxide, tetrabutylammonium hydroxide,choline, and other quaternary ammonium salts; dimethylethanolamine,triethanolamine, and other alcohol amines; pyrrol, piperidine,1,8-diazabicyclo[5.4.0]undec-7-ene, 1,5-diazabicyclo[4.3.0]non-5-ene,N-methylpyrrolidone, and other cyclic amines; etc. may be mentioned.These alkali compounds may be respectively used alone or as two types ormore combined.

As the aqueous medium which is used as the aqueous solution of an alkalicompound, water; methanol, ethanol, and other water soluble organicsolvents may be used. The alkali aqueous solution may have a surfactantetc. added in a suitable amount.

As the method for bringing the developing solution in contact with theresin film which has the latent patterns, for example, the puddlemethod, spray method, dipping method, and other methods may be used. Thedevelopment conditions are suitably selected as normally 0 to 100° C.,preferably 5 to 55° C., more preferably 10 to 30° C. and normally 30 to180 seconds.

The resin film which is formed with the targeted patterns in this waymay be rinsed by a rinse solution in accordance with need so as toremove development residue. After the rinse treatment, the remainingrinse solution is removed by compressed air or compressed nitrogen.

In one embodiment of the present invention, the resin film may becross-linked after patterning. The cross-linking can be performed by theabove-mentioned method.

(Electronic Device)

The electronic device of one embodiment of the present inventioncomprises the above-mentioned resin film of one embodiment of thepresent invention. The electronic device of one embodiment of thepresent invention is not particularly limited, but various electronicdevices may be mentioned. Specifically, a touch pallet or flexibleorganic EL display or other display device provided with a touch panelstructure etc. may be mentioned.

A display device provided with a touch panel structure of one example ofan electronic device of one embodiment of the present invention is notparticularly limited, but one comprised of a soda glass substrate orpolyethylene naphthalate film on which an electrode layer comprised of apair of ITO electrodes sandwiching an insulating film is arranged etc.may be mentioned. In this case, the above-mentioned resin film of oneembodiment of the present invention can be used as an insulating filmsandwiched between the electrode layers or a protective film forprotecting the touch panel structure.

The resin composition of one embodiment of the present inventioncontains the binder resin (A), alkoxysilyl group-containing(meth)acrylate compound (B), tetrafunctional or higher functional(meth)acrylate compound (C), and photopolymerization initiator (D),where the total content of the alkoxysilyl group-containing(meth)acrylate compound (B) and the tetrafunctional or higher functional(meth)acrylate compound (C) is made the above specific range, so theresin film which is obtained using the resin composition of oneembodiment of the present invention exhibits a high adhesion to asubstrate and is excellent in transparency and chemical resistance. Inparticular, the resin film which is obtained using the resin compositionof one embodiment of the present invention exhibits excellent adhesionto a soda glass substrate or polyethylene naphthalate film or othersubstrate which is used for a display provided with a touch panelstructure. For this reason, the resin film which is obtained using theresin composition of one embodiment of the present invention can besuitably used as an insulating film or protective film of a displaydevice provided with a touch panel structure.

EXAMPLES

Below, examples and comparative examples will be given to morespecifically explain one embodiment of the present invention. In theexamples, “parts” are based on weight unless otherwise indicated.

Note that, the definitions and methods of evaluation of the propertieswere as follows.

<Adhesion>

A soda glass substrate was coated with a resin composition by the spincoat method and prebaked using a hot plate at 110° C. for 2 minutes.Next, a 2.38 wt % tetramethylammonium hydroxide aqueous solution wasused to develop the composition at 25° C. for 30 seconds, then ultrapurewater was used for rinsing for 30 seconds. Next, ultraviolet light of alight intensity at 365 nm of 50 mJ/cm² was irradiated for 300 seconds inthe air. Next, an oven was used to heat the film in a nitrogenatmosphere at 230° C. for 30 minutes as post-baking to thereby obtain aresin film-coated substrate comprised of a resin film and a soda glasssubstrate. Note that, when forming the resin film, the speed at the timeof spin coating was controlled so that the film thickness afterpost-baking becomes about 2.0 μm. The obtained resin film-coatedsubstrate was stored in an environment of a temperature of 80° C. and ahumidity of 85% for 24 hours, then the surface and interfacial cuttinganalysis method (SAICAS method) was used to test for the adhesion(peeling strength).

Specifically, the resin film part of the above obtained resinfilm-coated substrate was formed with a cut of 1 mm width by a cutter. Ablade (made by 1.0 mm width, rake angle 20°, relief angle 10°noncrystalline diamond) was used to cut the sample at a horizontal speedof 0.2 μm/sec and a vertical speed of 0.02 μm/sec, and measured theadhesion using a measuring device constituted by a Saicas DN-20 modelmade by Daipla Wintes. When the blade cut to the interface between theresin film and the soda glass surface, the vertical speed was reduced to0 μm/sec and the blade was made to move parallel to the substrate tomeasure the horizontal force FH [N]. Further, from the width w [m] ofthe blade, the peeling strength P was found from the calculation formula“P[N/m]=FH[N]/w[m]”. The peeling strength P was made the value ofadhesion between the resin film and the soda glass substrate. In theexamples, 50 N/m or more was deemed as “good”.

<Transparency>

A resin film-coated substrate which was prepared using an alkali-freeglass substrate by a method similar to the evaluation of the aboveadhesion was used to measure transmittance in the range of wavelength400 nm to 700 nm at 1 nm intervals using a spectrophotometer (made byJAS(OX, “Ultraviolet Visible Spectrophotaneter V-560 (product name)”).The average of the total transmittance in the range of 400 nm to 700 nmwhich was obtained was measured as the transparency. Note that thetransparency was evaluated by the following criteria.

-   -   Good: total transmittance of 95% or more    -   Poor: total transmittance of less than 95%

<Chemical Resistance>

The resin film-coated substrate which was used for the above evaluationof adhesion was dipped in a solvent constituted by a mixture ofmonoethanolamine and N-methylpyrrolidone in a weight ratio of 7:3 at 65°C. for 5 minutes. The rate of change of thickness of the resin filmbefore and after dipping was measured to evaluate the chemicalresistance. Note that, the rate of change of thickness of resin filmbefore and after dipping was calculated in accordance with “rate ofchange of thickness of resin film before and after dipping (%)=(Ithickness of resin film after dipping-thickness of resin film beforedipping l/thickness of resin film before dipping)×100”. Further, thechemical resistance was evaluated by the following criteria.

-   -   Good: rate of change of thickness of resin film before and after        dipping of less than 3.0%    -   Fair: rate of change of thickness of resin film before and after        dipping of 3.0% to less than 5.0%    -   Poor: rate of change of thickness of resin film before and after        dipping of 5.0% or more

Synthesis Example 1 Preparation of Cyclic Olefin Polymer (A-1)

100 parts of monomer mixture comprised of 40 mol % ofN-phenyl-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide (NBPI) and 60 mol %of 4-hydroxycarbonyltetracyclo[6.2.1.1^(3,6).0^(2,7)]dodec-9-ene (TCDC),2.0 parts of 1,5-hexadiene, 0.02 part of(1,3-dimesitylimidazolin-2-ylidene) (tricyclohexylphosphine)benzylideneruthenium dichloride (synthesized by method described in Org. Lett.,vol. 1, pp. 953, 1999), and 200 parts of diethyleneglycolethylmethylether were charged into a nitrogen-substituted glass pressure-resistantreactor and stirred while making them react at 80° C. for 4 hours toobtain a polymerization reaction solution.

Further, the obtained polymerization reaction solution was placed in anautoclave and stirred at 150° C. at a hydrogen pressure 4 MPa for 5hours for a hydrogenation reaction to obtain a polymer solution whichcontains a cyclic olefin polymer (A-1). The polymerization conversionrate of the obtained cyclic olefin polymer (A-1) was 99.7%, the weightaverage molecular weight converted to polystyrene was 7,150, the numberaverage molecular weight was 4,690, the molecular weight distributionwas 1.52, and the hydrogenation rate was 99.7%. Further, the solidcontent concentration of the polymer solution of the obtained cyclicolefin polymer (A-1) was 34.4 wt %.

Synthesis Example 2 Preparation of Acrylic Resin (A-2)

20 parts of styrene, 25 parts of butyl methacrylate, 25 parts of2-ethylhexylacrylate, 30 parts of methacrylate, 0.5 part of2,2-azobisisobutyronitrile, and 300 parts of propyleneglycolmonomethylether acetate were stirred in a nitrogen stream while heating at 80° C.for 5 hours. The obtained resin solution was concentrated by a rotaryevaporator to obtain a solid content concentration 35 wt % acrylic resin(A-2) polymer solution.

Example 1

291 parts of the polymer solution of the cyclic olefin polymer (A-1)obtained in Synthesis Example 1 (as cyclic olefin polymer (A-1), 100parts) as a binder resin (A), 1 part of 3-acryloxypropyltrimethoxysilane (product name “KBM-5103”, made by Shin-Etsu Chemical)as an alkoxysilyl group-containing (meth)acrylate compound (B), 3 partsof dipentaerythritol penta/hexaacrylate (product name “Aronix M-406Penta 25-35%”, made by Toagosei) as a tetrafunctional or higherfunctional (meth)acrylate compound (C), 1 part of2-hydroxy-1-(4-[4-(2-hydroxy-2-methyl-propionyl)benzyl]phenyl-2-methylpropan-1-one(product name “Irgacure 127”, made by BASF) as a photopolymerizationinitiator (D), 15 parts of epoxylated butanetetracarboxylic acidtetrakis(3-cyclohexenylmethyl) modified ε-caprolactone (aliphatic cyclictetrafunctional epoxy resin, product name “Epolide GT401”, made byDaicel Chemical Industry) as a cross-linking agent (F), 0.03 part of asilicone-based surfactant (product name “KP-341”, made by Shin-EtsuChemical), and 270 parts of ethyleneglycolethylmethyl ether as a solventwere mixed and made to dissolve, then the mixture was filtered by a poresize 0.45 μm polytetrafluoroethylene filter to prepare a solid contentconcentration 20.7 wt % resin composition.

Further, the above obtained resin composition was used in accordancewith the above method to evaluate the adhesion and transparency. Theresults are shown in Table 1.

Example 2

Except for changing the amount of the 3-acryloxypropyltrimethoxysilanefrom 1 part to 0.5 part and changing the amount of dipentaerythritolpenta/hexaacrylate from 3 parts to 0.5 part, the same procedure wasfollowed as in Example 1 to prepare a solid content concentration 20.2wt % resin composition and the same procedure was followed to evaluateit. The results are shown in Table 1.

Example 3

Except for changing the amount of 3-acryloxypropyltrimethoxysilane from1 part to 3 parts and changing the amount of dipentaerythritolpenta/hexaacrylate from 3 parts to 1 part, the same procedure wasfollowed as in Example 1 to prepare a solid content concentration 20.7wt % resin composition and the same procedure was followed to evaluateit. The results are shown in Table 1.

Example 4

Except for changing the amount of dipentaerythritol penta/hexaacrylatefrom 3 parts to 7 parts, the same procedure was followed as in Example 1to prepare a solid content concentration 21.2 wt % resin composition andthe same procedure was followed to evaluate it. The results are shown inTable 1.

Example 5

Except for using, as the tetrafunctional or higher functional(meth)acrylate compound (C), instead of 3 parts of dipentaerythritolpenta/hexaacrylate, 3 parts of pentaerythritol tri/tetracrylate (productname “Aronix M-303 Tri 40-60%”, made by Toagosei), the same procedurewas followed as in Example 1 to prepare a solid content concentration20.7 wt % resin composition and the same procedure was followed toevaluate it. The results are shown in Table 1.

Example 6

Except for further mixing 1 part of 3,4-epoxy cyclohexylmethylmethacrylate (product name “Cyclomer M100”, made by Daicel) as an epoxygroup-containing (meth)acrylate compound (E), the same procedure wasfollowed as in Example 1 to prepare a solid content concentration 20.8wt % resin composition and the same procedure was followed to evaluateit. The results are shown in Table 1.

Example 7

Except for using, as the binder resin (A), instead of 291 parts of thepolymer solution of the cyclic olefin polymer (A-1), 285 parts of thepolymer solution of the acrylic resin (A-2) which was obtained inSynthesis Example 2 (as acrylic resin (A-2), 100 parts), the sameprocedure was followed as in Example 1 to prepare a solid contentconcentration 20.9 wt % resin composition and the same procedure wasfollowed to evaluate it. The results are shown in Table 1.

Example 8

Except for further mixing 0.5 part of 3,4-epoxy cyclohexylmethylmethacrylate (product name “Cyclomer M100”, made by Daicel) as an epoxygroup-containing (meth)acrylate compound (E), the same procedure wasfollowed as in Example 1 to prepare a solid content concentration 20.7wt % resin composition and the same procedure was followed to evaluateit. The results are shown in Table 1.

Example 9

Except for further mixing 4 parts of 3,4-epoxy cyclohexylmethylmethacrylate (product name “Cyclomer M100”, made by Daicel) as an epoxygroup-containing (meth)acrylate compound (E), the same procedure wasfollowed as in Example 1 to prepare a solid content concentration 21.2wt % resin composition and the same procedure was followed to evaluateit. The results are shown in Table 1.

Example 10

Except for further mixing 1 part of glycidyl methacrylate (made byMitsubishi Gas Chemical) as an epoxy group-containing (meth)acrylatecompound (E), the same procedure was followed as in Example 1 to preparea solid content concentration 20.8 wt % resin composition and the saneprocedure was followed to evaluate it. The results are shown in Table 1.

Comparative Example 1

Except for changing the amount of dipentaerythritol penta/hexaacrylatefrom 3 parts to 14 parts, the same procedure was followed as in Example1 to prepare a solid content concentration 22.1 wt % resin compositionand the same procedure was followed to evaluate it. The results areshown in Table 1.

Comparative Example 2

Except for further mixing 1 part of 3,4-epoxy cyclohexylmethylmethacrylate (product name “Cyclomer M100”, made by Daicel) as an epoxygroup-containing (meth)acrylate compound (E), the same procedure wasfollowed as in Comparative Example 1 to prepare a solid contentconcentration 22.3 wt % resin composition and the sane procedure wasfollowed to evaluate it. The results are shown in Table 1.

Comparative Examples 3

Except for changing the amount of 3-acryloxypropyltrimethoxysilane from1 part to 5 parts and changing the amount of dipentaerythritolpenta/hexaacrylate from 3 parts to 9 parts, the same procedure wasfollowed as in Example 1 to prepare a solid content concentration 22.0wt % resin composition and the same procedure was followed to evaluateit. The results are shown in Table 1.

Comparative Example 4

Except for changing the amount of 3-acryloxypropyltrimethoxysilane from1 part to 0.2 part and changing the amount of dipentaerythritolpenta/hexaacrylate from 3 parts to 0.2 part, the same procedure wasfollowed as in Example 1 to prepare a solid content concentration 20.2wt % resin composition and the same procedure was followed to evaluateit. The results are shown in Table 1.

Comparative Example 5

Except for not mixing dipentaerythritol penta/hexaacrylate, the sameprocedure was followed as in Example 1 to prepare a solid contentconcentration 20.2 wt % resin composition and the same procedure wasfollowed to evaluate it. The results are shown in Table 1.

Comparative Example 6

Except for not mixing 3-acryloxypropyltrimethoxysilane, the sameprocedure was followed as in Example 1 to prepare a solid contentconcentration 20.5 wt % resin composition and the same procedure wasfollowed to evaluate it. The results are shown in Table 1.

Comparative Example 7

Except for using, instead of 3 parts of dipentaerythritolpenta/hexaacrylate, 3 parts of trimethylolpropane triacrylate (productname “Aronix M-309”, made by Toagosei), the same procedure was followedas in Example 1 to prepare a solid content concentration 20.7 wt % resincomposition and the same procedure was followed to evaluate it. Theresults are shown in Table 1.

Comparative Example 8

Except for using, instead of 3 parts of dipentaerythritolpenta/hexaacrylate, 3 parts of ethylene glycol dimethacrylate (productname “NK Ester 1G”, made by Shin-Nakamura Chemical), the same procedurewas followed as in Example 1 to prepare a solid content concentration20.7 wt % resin composition and the same procedure was followed toevaluate it. The results are shown in Table 1.

Comparative Example 9

Except for using, instead of 3 parts of dipentaerythritolpenta/hexaacrylate, 3 parts of benzylacrylate (product name “FancrylFA-BZA”, made by Hitachi Chemical), the same procedure was followed asin Example 1 to prepare a solid content concentration 20.7 wt % resincomposition and the same procedure was followed to evaluate it. Theresults are shown in Table 1.

Comparative Example 10

Except for not mixing2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]phenyl}-2-methyl-propan-1-one,the same procedure was followed as in Example 1 to prepare a solidcontent concentration 20.5 wt % resin composition and the same procedurewas followed to evaluate it. The results are shown in Table 1.

TABLE 1 Examples 1 2 3 4 5 6 7 8 9 10 Composition of resin compositionCyclic olefin polymer (A-1) (parts) 100 100 100 100 100 100 100 100 100Acrylic resin (A-2) (parts) 100 3-acryloxypropyltrimethoxysilane (parts)1 0.5 3 1 1 1 1 1 1 1 (alkoxysilyl group-containing (meth)acrylatecompound (B)) Dipentaerythritol penta/hexaacrylate (parts) 3 0.5 1 7 3 33 3 3 (tetrafunctional or higher functional (meth)acrylate compound (C))Pentaerythritol tri/tetracrylate (parts) 3 (tetrafunctional or higherfunctional (meth)acrylate compound (C)) 3,4-epoxycyclohexylmethylmethacrylate (parts) 1 0.5 4 (epoxy group-containing (meth)acrylatecompound (E)) Glycidyl methacrylate (parts) 1 (epoxy group-containing(meth)acrylate compound (E)) Trimethylolpropane triacrylate (parts)(trifunctional (meth)acrylate compound) Ethylene glycol dimethacrylate(parts) (bifunctional (meth)acrylate compound) Benzylacrylate (parts)(monofunctional (meth)acrylate compound)2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)- (parts) 1 1 1 1 1 1 11 1 1 benzyl]phenyl}-2-methyl-propan-1-one Epoxylatedbutanetetracarboxylic acid tetrakis- (parts) 15 15 15 15 15 15 15 15 1515 (3-cyclohexenylmethyl)-modified ε-caprolactone Evaluation Adhesion(N/m) 191 131 142 139 149 231 101 206 211 218 Transparency Good GoodGood Good Good Good Good Good Good Good Chemical resistance Good GoodGood Good Good Good Good Good Good Good Comparative Examples 1 2 3 4 5 67 8 9 10 Composition of resin composition Cyclic olefin polymer (A-1)(parts) 100 100 100 100 100 100 100 100 100 100 Acrylic resin (A-2)(parts) 3-acryloxypropyltrimethoxysilane (parts) 1 1 5 0.2 1 1 1 1 1(alkoxysilyl group-containing (meth)acrylate compound (B))Dipentaerythritol penta/hexaacrylate (parts) 14 14 9 0.2 3 3(tetrafunctional or higher functional (meth)acrylate compound (C))Pentaerythritol tri/tetracrylate (parts) (tetrafunctional or higherfunctional (meth)acrylate compound (C)) 3,4-epoxycyclohexylmethylmethacrylate (parts) 1 (epoxy group-containing (meth)acrylate compound(E)) Glycidyl methacrylate (parts) (epoxy group-containing(meth)acrylate compound (E)) Trimethylolpropane triacrylate (parts) 3(trifunctional (meth)acrylate compound) Ethylene glycol dimethacrylate(parts) 3 (bifunctional (meth)acrylate compound) Benzylacrylate (parts)3 (monofunctional (meth)acrylate compound)2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)- (parts) 1 1 1 1 1 1 11 1 benzyl]phenyl}-2-methyl-propan-1-one Epoxylatedbutanetetracarboxylic acid tetrakis- (parts) 15 15 15 15 15 15 15 15 1515 (3-cyclohexenylmethyl)-modified ε-caprolactone Evaluation Adhesion(N/m) 39 41 29 39 33 27 31 33 22 43 Transparency Good Good Good GoodGood Good Good Good Good Good Chemical resistance Good Good Good GoodGood Good Good Good Good Good

As shown in Table 1, a resin film which is obtained using a resincomposition which contains a binder resin (A), alkoxysilylgroup-containing (meth)acrylate compound (B), tetrafunctional or higherfunctional (meth)acrylate compound (C), and photopolymerizationinitiator (D), where a total content of the alkoxysilyl group-containing(meth)acrylate compound (B) and the tetrafunctional or higher(meth)acrylate compound (C) with respect to 100 parts by weight of thebinder resin (A) is made 0.5 to 10 parts by weight, was high in adhesionto a substrate and excellent in transparency and chemical resistance(Examples 1 to 9). Among these as well, Examples 6, 8, and 9 furthercontaining the epoxy group-containing (meth)acrylate compound (E) areexcellent in adhesion to a substrate and are particularly excellent inresults.

On the other hand, when making the total content of the alkoxysilylgroup-containing (meth)acrylate compound (B) constituted by3-acryloxypropyl trimethoxysilane and the tetrafunctional or higherfunctional (meth)acrylate compound (C) constituted by dipentaerythritolpenta/hexaacrylate less than 0.5 part by weight or over 10 parts byweight, the obtained resin film became inferior in adhesion to asubstrate (Comparative Examples 1 to 4).

Further, when not mixing the alkoxysilyl group-containing (meth)acrylatecompound (B) constituted by 3-acryloxypropyltrimethoxysilane, thetetrafunctional or higher functional (meth)acrylate compound (C)constituted by dipentaerythritol penta/hexaacrylate, or thephotopolymerization initiator (D) constituted by2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]phenyl}-2-methyl-propan-1-one,the obtained resin film became inferior in adhesion to a substrate(Comparative Examples 5 to 10).

1. A resin composition comprising a binder resin (A), alkoxysilylgroup-containing (meth)acrylate compound (B), tetrafunctional or higherfunctional (meth)acrylate compound (C), and photopolymerizationinitiator (D), wherein a total content of the alkoxysilylgroup-containing (meth)acrylate compound (B) and the tetrafunctional orhigher functional (meth)acrylate compound (C) is 0.5 to 10 parts byweight with respect to 100 parts by weight of the binder resin (A). 2.The resin composition according to claim 1 wherein a content of thealkoxysilyl group-containing (meth)acrylate compound (B) is 0.25 to 4parts by weight with respect to 100 parts by weight of the binder resin(A).
 3. The resin composition according to claim 1 wherein a content ofthe tetrafunctional or higher functional (meth)acrylate compound (C) is0.25 to 7 parts by weight with respect to 100 parts by weight of thebinder resin (A).
 4. The resin composition according to claim 1containing, as the tetrafunctional or higher functional (meth)acrylatecompound (C), tetrafunctional or higher functional (meth)acrylatecompounds with different numbers of functional groups in combination. 5.The resin composition according to claim 1 further comprising an epoxygroup-containing (meth)acrylate compound (E).
 6. The resin compositionaccording to claim 5 wherein a content of the epoxy group-containing(meth)acrylate compound (E) is 0.5 to 5 parts by weight with respect to100 parts by weight of the binder resin (A).
 7. The resin compositionaccording to claim 1 wherein the binder resin (A) is a cyclic olefinpolymer having a protonic polar group (A1), acrylic resin (A2), Cardoresin (A3), polysiloxane (A4), or polyimide (A5).
 8. The resincomposition according to claim 1 wherein the photopolymerizationinitiator (D) is a radical generating type photopolymerizationinitiator, and a content of the photopolymerization initiator (D) is 0.3to 8 parts by weight with respect to 100 parts by weight of the binderresin (A).
 9. A resin film obtained using the resin compositionaccording to claim
 1. 10. An electronic device comprising the resin filmaccording to claim 9.